SCHEMBL1270754

SCHEMBL1270754

CC(C)O[Pb]OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22686515 0.60
SCHEMBL29187220 0.60
SCHEMBL275872 0.60
SCHEMBL27648092 0.60
Hydrochloric Acid SCHEMBL2823467 0.57
SCHEMBL18813467 0.57
SCHEMBL7174814 0.54
Isobutane SCHEMBL8653157 0.54
SCHEMBL28095 0.53
SCHEMBL1296 0.53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-6053143-A None JP disclosed
US-20240376257-A1 POLY(GLYCOLIC ACID) FOR CONTAINERS AND FILMS WITH REDUCED GAS PERMEABILITY DAK AMERICAS LLC (US) 2024-11-14 US disclosed
US-12065538-B2 Poly(glycolic acid) for containers and films with reduced gas permeability DAK AMERICAS LLC (US) 2024-08-20 US disclosed
CN-113045736-B Poly (glycolic acid) for containers and films having reduced gas permeability 美国达克有限责任公司 2024-08-02 CN disclosed
US-20230323020-A1 POLY(GLYCOLIC ACID) FOR CONTAINERS AND FILMS WITH REDUCED GAS PERMEABILITY DAK AMERICAS LLC 2023-10-12 US disclosed
US-11548979-B2 Poly(glycolic acid) for containers and films with reduced gas permeability DAK AMERICAS LLC (US) 2023-01-10 US disclosed
US-11155677-B2 Process for making poly(glycolic acid) for containers and films with reduced gas permeability DAK AMERICAS LLC (US) 2021-10-26 US disclosed
US-20210198422-A1 POLY(GLYCOLIC ACID) FOR CONTAINERS AND FILMS WITH REDUCED GAS PERMEABILITY DAK AMERICAS LLC (US) 2021-07-01 US disclosed
US-20210198424-A1 PROCESS FOR MAKING POLY(GLYCOLIC ACID) FOR CONTAINERS AND FILMS WITH REDUCED GAS PERMEABILITY DAK AMERICAS LLC (US) 2021-07-01 US disclosed
US-10618285-B2 Piezoelectric substrate and method of manufacturing the piezoelectric substrate, and liquid ejection head CANON KABUSHIKI KAISHA (JP) 2020-04-14 US disclosed
US-20040129917-A1 Composition for forming piezoelectric film, manufacturing method of piezoelectric film, piezoelectric element and ink jet recording head CANON KABUSHIKI KAISHA (JP) 2004-07-08 US disclosed
US-20040125176-A1 Composition for forming piezoelectric, method for producing piezoelectric film, piezoelectric element and ink jet recording head CANON KABUSHIKI KAISHA (JP) 2004-07-01 US disclosed
US-20030203275-A1 Battery and method for generating an electric power MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2003-10-30 US disclosed
US-6596431-B1 Battery and method for generating an electric power MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2003-07-22 US disclosed
EP-1119067-A2 Battery and method for generating an electric power MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2001-07-25 EP disclosed
EP-1067609-A1 PIEZOELECTRIC THIN FILM DEVICE, ITS PRODUCTION METHOD, AND INK-JET RECORDING HEAD Kansai Research Institute (JP) 2001-01-10 EP disclosed
US-6126743-A REACTING THREE DIFFERENT METAL OXIDES OR COMPOUNDS OF SPECIFIC DIAMETERS, FIRING OR HEATING THE MIXTURE AT A TEMPERATURE 400-1200 DEGREE C AT WHICH CRYSTAL PHASE CAN BE FORMED SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-10-03 US disclosed
JP-2000119021-A RAW MATERIAL SOLUTION FOR FORMING FILM OF FERROELECTRIC THIN FILM AND FORMATION OF FILM MITSUBISHI MATERIALS CORP 2000-04-25 JP disclosed
US-5354514-A Heating mixture of thioamide compound and copper- or lead-containing compound JUJO PAPER CO., LTD. (JP) 1994-10-11 US disclosed
JP-H0653143-A MANUFACTURE OF COMPOSITE OXIDE THIN FILM ROHM CO LTD 1994-02-25 JP disclosed