Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 2/20 | 0.33 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.33 |
| ▸ | AR | P10275 | 1/20 | 0.31 |
| ▸ | PPARA | Q07869 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13225469 | 0.89 | ESR1 (0.33) | ESR1ESR2AR | |
| SCHEMBL16207348 | 0.86 | MAPK1 (0.36) | ESR1ESR2AR | |
| SCHEMBL13762493 | 0.85 | GLA (0.37) | ESR1ESR2PPARA | |
| SCHEMBL14521926 | 0.83 | ESR1 (0.33) | ESR1ESR2AR | |
| SCHEMBL14629625 | 0.83 | ESR1 (0.33) | ESR1ESR2AR | |
| SCHEMBL19788403 | 0.82 | ESR1 (0.37) | ESR1ESR2AR | |
| SCHEMBL13225470 | 0.80 | — | — | |
| SCHEMBL12841675 | 0.78 | NPC1 (0.33) | — | |
| SCHEMBL21440417 | 0.77 | ESR1 (0.39) | ESR1ESR2AR | |
| SCHEMBL14540271 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9012572-B2 | Polyphenylene ether oligomer and article employing the same | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2015-04-21 | — | — | US | disclosed |
| US-20140323666-A1 | POLYPHENYLENE ETHER OLIGOMER AND ARTICLE EMPLOYING THE SAME | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2014-10-30 | — | — | US | disclosed |
| US-7910836-B2 | Multilayered printed circuit board, solder resist composition, and semiconductor device | IBIDEN CO. LTD. (JP) | 2011-03-22 | — | — | US | disclosed |
| US-7595362-B2 | Curable resin composition | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2009-09-29 | — | — | US | disclosed |
| US-7541408-B2 | Curable resin composition, curable film and cured film | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2009-06-02 | — | — | US | disclosed |
| US-20080041615-A1 | Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device | IBIDEN CO., LTD (JP) | 2008-02-21 | — | — | US | disclosed |