SCHEMBL1298502

SCHEMBL1298502

CCCCOCC(CC)CC

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.61
MMP9 P14780 1/20 0.45
MMP8 P22894 1/20 0.45
MMP14 P50281 1/20 0.45
TSHR P16473 2/20 0.44
USP2 O75604 1/20 0.43
HTT P42858 1/20 0.42
ALDH1A1 P00352 3/20 0.41
L3MBTL1 Q9Y468 1/20 0.39
SPHK1 Q9NYA1 1/20 0.38
ADRB2 P07550 1/20 0.38
ADRB1 P08588 1/20 0.38
ADRB3 P13945 1/20 0.38
PRKD3 O94806 1/20 0.37
PRKCG P05129 1/20 0.37
PRKCB P05771 1/20 0.37
PRKCA P17252 1/20 0.37
PRKCH P24723 1/20 0.37
PRKCI P41743 1/20 0.37
PRKCE Q02156 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2241603 0.88 CYP3A4 (0.78) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL11762157 0.86 CYP3A4 (0.53) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL26765910 0.85 CYP3A4 (0.57) CYP3A4MMP9MMP8MMP14USP2
SCHEMBL9011644 0.84 CYP3A4 (0.72) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL29886916 0.84 CYP3A4 (0.72) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL9011640 0.84 CYP3A4 (0.72) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL1298795 0.83 HSD17B10 (0.52) CYP3A4MMP9MMP8MMP14USP2
SCHEMBL5469162 0.83 CYP3A4 (0.78) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL9011580 0.83 CYP3A4 (0.70) CYP3A4MMP9MMP8MMP14TSHR
SCHEMBL9011850 0.83 CYP3A4 (0.70) CYP3A4MMP9MMP8MMP14TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101589121-B Hard coating composition MITSUI CHEMICALS INC 2012-05-23 CN disclosed
EP-2407576-A1 PROCESS FOR REMOVING RESIDUAL WATER MOLECULES IN PROCESS FOR PRODUCING METALLIC THIN FILM, AND PURGE SOLVENT Adeka Corporation (JP) 2012-01-18 EP disclosed
US-20110268887-A1 PROCESS FOR REMOVING RESIDUAL WATER MOLECULES IN METALLIC-THIN-FILM PRODUCTION METHOD AND PURGE SOLVENT ADEKA CORPORATION (JP) 2011-11-03 US disclosed
CN-101589121-A Hard coating composition MITSUI CHEMICALS INC (JP) 2009-11-25 CN disclosed