SCHEMBL1305848

SCHEMBL1305848

CC=CC(C)=CCC=C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1305846 1.00
SCHEMBL6202023 1.00
SCHEMBL26131835 1.00
SCHEMBL1305392 0.83 NR1I2 (0.34)
SCHEMBL1305390 0.83 NR1I2 (0.34)
SCHEMBL16167296 0.81 KMT2A (0.54)
SCHEMBL30866989 0.81 KMT2A (0.54)
SCHEMBL31659053 0.77
SCHEMBL31659036 0.77
SCHEMBL31659078 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7012120-B2 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent HENKEL CORPORATION (US) 2006-03-14 US claimed
US-20050288458-A1 Reworkable thermosetting resin composition KLEMARCZYK PHILIP T 2005-12-29 US claimed
EP-1268457-A4 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORP (US) 2005-07-20 EP claimed
JP-2003529643-A 2003-10-07 JP claimed
CN-1427831-A Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent HENKEL LOCTITE CORP (US) 2003-07-02 CN claimed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US claimed
EP-1268457-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2003-01-02 EP claimed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO claimed
CN-115996904-A Process for preparing conjugated dienes from allyl alcohol 奇华顿股份有限公司 2023-04-21 CN disclosed
US-8053587-B2 for mounting onto a circuit board semiconductor devices HENKEL CORPORATION (US) 2011-11-08 US disclosed
US-20080214840-A1 Reworkable thermosetting resin composition HENKEL CORPORATION (US) 2008-09-04 US disclosed
US-7012120-B2 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent HENKEL CORPORATION (US) 2006-03-14 US disclosed
US-20050288458-A1 Reworkable thermosetting resin composition KLEMARCZYK PHILIP T 2005-12-29 US disclosed
CN-1232515-C Reworkable composition of ethylene oxide or thiirane containing resin and curing agent HENKEL CORP (US) 2005-12-21 CN disclosed
EP-1268457-A4 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORP (US) 2005-07-20 EP disclosed
CN-1431220-A Biosynthesis gene cluster of Nanchang UNIV SHANGHAI JIAOTONG (CN) 2003-07-23 CN disclosed
CN-1427831-A Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent HENKEL LOCTITE CORP (US) 2003-07-02 CN disclosed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US disclosed
EP-1268457-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2003-01-02 EP disclosed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO disclosed