SCHEMBL13104232

SCHEMBL13104232

CC1C2CC(OCC(O)(C(F)(F)F)C(F)(F)F)C(C2)C1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19245757 0.86
SCHEMBL17853841 0.86
SCHEMBL13681840 0.83
SCHEMBL14274392 0.83
SCHEMBL13683730 0.83
SCHEMBL14509296 0.74
SCHEMBL15267975 0.73
SCHEMBL13305426 0.73
SCHEMBL2681346 0.73
SCHEMBL13118551 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11009793-B2 Monomer, polymer, resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-05-18 US disclosed
US-9790166-B2 Polymer, monomer, resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-17 US disclosed
US-20170226252-A1 MONOMER, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-08-10 US disclosed
US-20170131635-A1 MONOMER, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-11 US disclosed
US-20160342086-A1 POLYMER, MONOMER, RESIST COMPOSITION, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-11-24 US disclosed
US-8741538-B2 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2014-06-03 US disclosed
US-7807328-B2 base resin comprises homo-/copolyenes having alkali soluble group, exhibits changed alkali solubility under action of acid, acid generator, and tertiary alkanolamines; for patterning semiconductor integrated circuit via lithography; improved resolution TOKYO OHKA KOGYO CO., LTD. (JP) 2010-10-05 US disclosed
US-20100151383-A1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-06-17 US disclosed
US-7700259-B2 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-20 US disclosed
US-7666572-B2 Resist top coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-02-23 US disclosed
US-7592122-B2 Photoresist composition, and low-molecular compound and high-molecular compound for the photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2009-09-22 US disclosed
US-20070298355-A1 Resist top coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-12-27 US disclosed
US-20070224520-A1 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2007-09-27 US disclosed
US-20070172757-A1 Polymer compound, photoresist composition including the polymer compound, and resist pattern formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-26 US disclosed