SCHEMBL131702

SCHEMBL131702

CCc1ncc[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL30638598 0.97 — —
SCHEMBL28550216 0.97 — —
Bromide SCHEMBL28392885 0.97 — —
Ammonia Solution, Strong SCHEMBL30638599 0.97 — —
Iodide SCHEMBL633203 0.97 — —
SCHEMBL4397237 0.97 — —
Water SCHEMBL7137776 0.97 TAAR1 (0.53) —
Iodide SCHEMBL28564958 0.97 — —
Water SCHEMBL29051398 0.97 — —
SCHEMBL30859449 0.97 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 13866 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122077251-A Lead-free halogen-free soldering paste for QFN device and preparation method thereof — 2026-05-26 — — CN claimed
CN-117619041-B Separation method of polycyclic aromatic hydrocarbon TAIYUAN UNIVERSITY OF TECHNOLOGY (CN) 2026-05-26 — — CN claimed
CN-122091303-A Low-temperature conductive paste for metal plate printing and preparation method thereof — 2026-05-26 — — CN claimed
CN-122080895-A Polyglycolic acid composition and preparation method thereof, biodegradable polyester material and application thereof, and PGA temporary plugging ball and preparation method thereof — 2026-05-26 — — CN claimed
CN-122071631-A Polyglycolic acid temporary plugging agent with controllable degradation rate and preparation method and application thereof 中国石油化工股份有限公司 2026-05-22 — — CN claimed
CN-120484446-B Resin glue solution for copper-clad plate, high heat-resistant copper-clad plate and preparation method 俊萱新材料(杭州)有限公司 2026-05-19 — — CN claimed
CN-115819724-B Epoxy-cycloolefin resin composition, thermosetting resin material and preparation method thereof 上海中化科技有限公司 2026-05-15 — — CN claimed
EP-4731688-A1 METHOD FOR THE PRODUCTION OF A HYDROXYL-GROUP TERMINATED OXAZOLIDINONE COMPOSITION Covestro Deutschland AG (DE) 2026-04-29 — — EP claimed
CN-121583646-A Composite conductive material and preparation method and application thereof 广东电网有限责任公司惠州供电局 2026-02-27 — — CN claimed
CN-121571882-A High-reliability water-based low-solid soldering flux for electronic welding and preparation method thereof 云南锡业新材料有限公司 2026-02-27 — — CN claimed
EP-0013905-B1 4,5-DICHLORO-IMIDAZOLE DERIVATIVES, THEIR PREPARATION AND THEIR APPLICATION AS HERBICIDES BAYER AG (DE) 1982-05-05 — — EP claimed
US-4322327-A Slow-curing water-curable urethane prepolymer composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1982-03-30 — — US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 — — US claimed
US-4283219-A PLANT GROWTH REGULATORS BAYER AKTIENGESELLSCHAFT (DE) 1981-08-11 — — US claimed
US-4263181-A Chemically stabilized azulmic acids, processes for their preparation and their use BAYER AKTIENGESELLSCHAFT (DE) 1981-04-21 — — US claimed
EP-0013905-A1 4,5-Dichloro-imidazole derivatives, their preparation and their application as herbicides BAYER AG (DE) 1980-08-06 — — EP claimed
US-4105656-A PROCESS FOR PREPARING 3-N-MONOSUBSTITUTED AMINO-4-SUBSTITUTED-5-PYRAZOLONES FUJI PHOTO FILM CO., LTD. (JP) 1978-08-08 — — US claimed
US-4041007-A WITH AN AROMATIC AMINE CURING AGENT, A CLAY FILLER, AND AN IMIDAZOLE RETARDING AGENT TO EXTEND SHELF LIFE YOUNGSTOWN SHEET AND TUBE COMPANY (US) 1977-08-09 — — US claimed
US-3997552-A HERBICIDE BAYER AKTIENGESELLSCHAFT (DT) 1976-12-14 — — US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 — — US claimed
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