SCHEMBL131702

SCHEMBL131702

CCc1ncc[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL30638598 0.97
SCHEMBL28550216 0.97
Water SCHEMBL29051398 0.97
Iodide SCHEMBL28564958 0.97
Ammonia Solution, Strong SCHEMBL30638599 0.97
SCHEMBL4397237 0.97
Bromide SCHEMBL28392885 0.97
Water SCHEMBL7137776 0.97 TAAR1 (0.53)
Iodide SCHEMBL633203 0.97
SCHEMBL30859449 0.97

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 13866 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122077251-A Lead-free halogen-free soldering paste for QFN device and preparation method thereof 2026-05-26 CN claimed
CN-117619041-B Separation method of polycyclic aromatic hydrocarbon TAIYUAN UNIVERSITY OF TECHNOLOGY (CN) 2026-05-26 CN claimed
CN-122091303-A Low-temperature conductive paste for metal plate printing and preparation method thereof 2026-05-26 CN claimed
CN-122080895-A Polyglycolic acid composition and preparation method thereof, biodegradable polyester material and application thereof, and PGA temporary plugging ball and preparation method thereof 2026-05-26 CN claimed
CN-122071631-A Polyglycolic acid temporary plugging agent with controllable degradation rate and preparation method and application thereof 中国石油化工股份有限公司 2026-05-22 CN claimed
CN-120484446-B Resin glue solution for copper-clad plate, high heat-resistant copper-clad plate and preparation method 俊萱新材料(杭州)有限公司 2026-05-19 CN claimed
CN-115819724-B Epoxy-cycloolefin resin composition, thermosetting resin material and preparation method thereof 上海中化科技有限公司 2026-05-15 CN claimed
EP-4731688-A1 METHOD FOR THE PRODUCTION OF A HYDROXYL-GROUP TERMINATED OXAZOLIDINONE COMPOSITION Covestro Deutschland AG (DE) 2026-04-29 EP claimed
CN-121583646-A Composite conductive material and preparation method and application thereof 广东电网有限责任公司惠州供电局 2026-02-27 CN claimed
CN-121571882-A High-reliability water-based low-solid soldering flux for electronic welding and preparation method thereof 云南锡业新材料有限公司 2026-02-27 CN claimed
EP-0013905-B1 4,5-DICHLORO-IMIDAZOLE DERIVATIVES, THEIR PREPARATION AND THEIR APPLICATION AS HERBICIDES BAYER AG (DE) 1982-05-05 EP claimed
US-4322327-A Slow-curing water-curable urethane prepolymer composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1982-03-30 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
US-4283219-A PLANT GROWTH REGULATORS BAYER AKTIENGESELLSCHAFT (DE) 1981-08-11 US claimed
US-4263181-A Chemically stabilized azulmic acids, processes for their preparation and their use BAYER AKTIENGESELLSCHAFT (DE) 1981-04-21 US claimed
EP-0013905-A1 4,5-Dichloro-imidazole derivatives, their preparation and their application as herbicides BAYER AG (DE) 1980-08-06 EP claimed
US-4105656-A PROCESS FOR PREPARING 3-N-MONOSUBSTITUTED AMINO-4-SUBSTITUTED-5-PYRAZOLONES FUJI PHOTO FILM CO., LTD. (JP) 1978-08-08 US claimed
US-4041007-A WITH AN AROMATIC AMINE CURING AGENT, A CLAY FILLER, AND AN IMIDAZOLE RETARDING AGENT TO EXTEND SHELF LIFE YOUNGSTOWN SHEET AND TUBE COMPANY (US) 1977-08-09 US claimed
US-3997552-A HERBICIDE BAYER AKTIENGESELLSCHAFT (DT) 1976-12-14 US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US claimed