SCHEMBL1317445

SCHEMBL1317445

N=C=O.N=C=O.[HH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6359566 1.00
Methane SCHEMBL28087211 0.94
SCHEMBL27972207 0.94
Methane SCHEMBL5820454 0.94
SCHEMBL136388 0.93
SCHEMBL4020 0.93
SCHEMBL15006 0.93
SCHEMBL10805026 0.93
SCHEMBL21669 0.93
SCHEMBL6245666 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0545227-B1 Metallized polyester film capacitor MITSUBISHI POLYESTER FILM CORP (JP) 1999-01-27 EP claimed
US-5738926-A WATER SOLUBLE OR WATER DISPERSIBLE COATINGS COMPRISING ANIONIC POLYESTER OR POLYURETHANE COPOLYMER OR POLYESTERURETHANE COPOLYMERS; ADHESION DIAFOIL HOECHST COMPANY LIMITED (JP) 1998-04-14 US claimed
EP-0545227-A2 Metallized polyester film capacitor DIAFOIL HOECHST CO., LTD (JP) 1993-06-09 EP claimed
US-20220203321-A1 MICROCAPSULE AND METHOD FOR PRODUCING MICROCAPSULE FUJIFILM CORPORATION (JP) 2022-06-30 US disclosed
CN-110627981-B Optical resin composition, optical resin material, preparation method and application thereof 万华化学集团股份有限公司 2022-01-07 CN disclosed
WO-2021131181-A1 DEGRADATION ACCELERATOR FOR BIODEGRADABLE RESIN, BIODEGRADABLE RESIN COMPOSITION, BIODEGRADABLE RESIN MOLDED PRODUCT, AND METHOD FOR PRODUCING DEGRADATION ACCELERATOR FOR BIODEGRADABLE RESIN 三菱ケミカル株式会社 2021-07-01 WO disclosed
US-10953628-B2 Laminate having oxygen barrier properties and packaging material comprising laminate DAI NIPPON PRINTING CO., LTD. (JP) 2021-03-23 US disclosed
WO-2020241479-A1 SELF-EMULSIFYING POLYISOCYANATE COMPOSITION, TWO-PACK TYPE COATING COMPOSITION AND COATING FILM 東ソー株式会社 2020-12-03 WO disclosed
WO-2020202634-A1 MICROCAPSULES, MICROCAPSULE COMPOSITION, INK COMPOSITION, COATING MATERIAL, AND RESIN COMPOSITION 富士フイルム株式会社 2020-10-08 WO disclosed
US-10619058-B2 Curable composition TOAGOSEI CO., LTD. (JP) 2020-04-14 US disclosed
US-10611856-B2 Curable composition TOAGOSEI CO., LTD. (JP) 2020-04-07 US disclosed
US-5843573-A Polyester resin composition NIPPON SHOKUBAI CO., LTD. (JP) 1998-12-01 US disclosed
US-5738926-A WATER SOLUBLE OR WATER DISPERSIBLE COATINGS COMPRISING ANIONIC POLYESTER OR POLYURETHANE COPOLYMER OR POLYESTERURETHANE COPOLYMERS; ADHESION DIAFOIL HOECHST COMPANY LIMITED (JP) 1998-04-14 US disclosed
EP-0572682-B1 PROCESS FOR PRODUCING HIGH-MOLECULAR ALIPHATIC POLYESTER, AND FILM SHOWA HIGHPOLYMER (JP) 1997-10-01 EP disclosed
US-5616681-A CARRYING OUT RING-OPENING POLYMERIZATION OF CYCLIC ACID ANHYDRIDE WITH CYCLIC ETHER IN PRESENCE OF ZIRCONIUM COMPOUND NIPPON SHOKUBAI CO., LTD. (JP) 1997-04-01 US disclosed
EP-0718366-A2 Polyester resin composition NIPPON SHOKUBAI CO., LTD. (JP) 1996-06-26 EP disclosed
EP-0710685-A2 Process for producing aliphatic polyester NIPPON SHOKUBAI CO., LTD. (JP) 1996-05-08 EP disclosed
US-5436056-A Copolymerizing polyester having hydroxyl end gropus with a polyisocyanate to form polyesterurethane copolymer in presence of titanium catalyst SHOWA HIGHPOLYMER CO., LTD. (JP) 1995-07-25 US disclosed
EP-0572682-A1 PROCESS FOR PRODUCING HIGH-MOLECULAR ALIPHATIC POLYESTER, AND FILM SHOWA HIGHPOLYMER CO., LTD. (JP) 1993-12-08 EP disclosed
EP-0545227-A2 Metallized polyester film capacitor DIAFOIL HOECHST CO., LTD (JP) 1993-06-09 EP disclosed