SCHEMBL1318364

SCHEMBL1318364

C=CC(=O)OCCC1(C)CO1

nearest known ligand 0.47

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.47
HPGD P15428 1/20 0.47
ALDH1A1 P00352 5/20 0.47
TP53 P04637 3/20 0.47
HIF1A Q16665 3/20 0.47
CYP3A4 P08684 2/20 0.47
HSD17B10 Q99714 1/20 0.47
THRB P10828 2/20 0.40
MAPK1 P28482 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1318275 0.90 TSHR (0.53) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1317280 0.88 TSHR (0.56) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL17839038 0.86 TSHR (0.44) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1316484 0.81 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL2132862 0.81 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL3594948 0.79 TSHR (0.49) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL28217653 0.77 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL28213334 0.75 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1357080 0.75 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL9923829 0.74 TSHR (0.56) TSHRHPGDALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109799680-B Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-108241257-B Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2022-11-08 CN disclosed
CN-104726032-B Adhesive film, dicing die-bonding film, method for manufacturing semiconductor device, and semiconductor device 日东电工株式会社 2020-08-11 CN disclosed
CN-109799680-A Chemical amplification positive photosensitive resin composition and its application 奇美实业股份有限公司 2019-05-24 CN disclosed
US-10251265-B2 Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-04-02 US disclosed
CN-108241256-A Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2018-07-03 CN disclosed
CN-108241257-A Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2018-07-03 CN disclosed
US-20180098425-A1 PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2018-04-05 US disclosed
CN-102213918-B Positive type radiation-sensitive composition, inter-layer insulating film and forming method therefor JSR CORP 2014-07-16 CN disclosed
CN-102967970-A Array substrate, liquid display element, and method for manufacturing array subsrtate JSR CORP 2013-03-13 CN disclosed
US-20110281040-A1 LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF JSR CORPORATION (JP) 2011-11-17 US disclosed
US-20110272185-A1 PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-11-10 US disclosed
CN-102213918-A Positive type radiation-sensitive composition, inter-layer insulating film and forming method therefor JSR CORP 2011-10-12 CN disclosed
US-20100021788-A1 POLYMER ELECTROLYTE COMPOSITE FILM, MEMBRANE-ELECTRODE ASSEMBLY AND FUEL CELL CANON KABUSHIKI KAISHA (JP) 2010-01-28 US disclosed
WO-2008143303-A1 POLYMER ELECTROLYTE COMPOSITE FILM, MEMBRANE-ELECTRODE ASSEMBLY AND FUEL CELL CANON KABUSHIKI KAISHA (JP) 2008-11-27 WO disclosed