SCHEMBL132030

SCHEMBL132030

[Si].[W]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9146043 1.00
SCHEMBL28236421 1.00
SCHEMBL27844513 1.00
SCHEMBL28591131 1.00
SCHEMBL132029 1.00
SCHEMBL9146049 1.00
SCHEMBL5308071 0.82
SCHEMBL9419859 0.82
SCHEMBL11444359 0.82
SCHEMBL8434679 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2419 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115623773-B SRAM memory cell based on composite structure SOI MOS anti-radiation device XIDIAN UNIVERSITY (CN) 2026-05-26 CN claimed
EP-4111051-B1 TUNGSTEN-BASED EROSION-RESISTANT LEADING EDGE PROTECTION CAP FOR ROTOR BLADES LM WIND POWER AS (DK) 2026-04-01 EP claimed
US-20260026032-A1 METAL GATED LIGHTLY DOPED DRAIN STRING DRIVER DEVICE AND METHOD THEREOF MICRON TECHNOLOGY INC (US) 2026-01-22 US claimed
US-12519014-B2 Semiconductor structure including an electrode cover layer over a capacitor of a dynamic random access memory (DRAM) formed in a substrate, and a contact structure electrically connected to the electrode cover layer, and method of making the same CHANGXIN MEMORY TECHNOLOGIES, INC. (CN) 2026-01-06 US claimed
US-20250318110-A1 SEMICONDUCTOR DEVICES SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-10-09 US claimed
US-12431407-B2 Memory device with low density thermal barrier MICRON TECHNOLOGY, INC. (US) 2025-09-30 US claimed
US-20250294750-A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE KIOXIA CORPORATION (JP) 2025-09-18 US claimed
US-12394632-B2 Plasma processing method and plasma processing system TOKYO ELECTRON LIMITED (JP) 2025-08-19 US claimed
US-20250234520-A1 SEMICONDUCTOR STRUCTURE INCLUDING POLYSILICON AS BOTTOM LAYER OF BIT LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME NANYA TECHNOLOGY CORPORATION (TW) 2025-07-17 US claimed
US-20250234516-A1 SEMICONDUCTOR STRUCTURE INCLUDING POLYSILICON AS BOTTOM LAYER OF BIT LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME NANYA TECHNOLOGY CORPORATION (TW) 2025-07-17 US claimed
CN-1037723-C Method for manufacturing read-only memory by ion implantation technology MAOXI ELECTRONIC CO LTD TAIWAN (CN) 1998-03-11 CN claimed
US-5691223-A Method of fabricating a capacitor over a bit line DRAM process MOSEL VITELIC INC. (TW) 1997-11-25 US claimed
US-5583065-A Method of making a MOS semiconductor device SONY CORPORATION (JP) 1996-12-10 US claimed
CN-1125640-A Isobutane and butene alkylated solid heteropoly acid salt catalyzer CHINA PETROCHEMICAL CORP (CN) 1996-07-03 CN claimed
EP-0718868-A2 Polysilicon/Polycide etch process for sub-micron gate stacks SIEMENS AKTIENGESELLSCHAFT (DE) 1996-06-26 EP claimed
US-5529197-A Polysilicon/polycide etch process for sub-micron gate stacks SIEMENS AKTIENGESELLSCHAFT (DE) 1996-06-25 US claimed
CN-1120232-A Method for manufacturing read-only memory by ion implantation technology MAOXI ELECTRONIC CO LTD TAIWAN (CN) 1996-04-10 CN claimed
CN-1005880-B Method for depositing vertical resistor 英特尔公司 1989-11-22 CN claimed
CN-86107982-A Deposit the method for vertical direction resistance with the chemical vapour deposition technique of plasma enhancing 1987-08-12 CN claimed
US-4536943-A Method of manufacturing a FET TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-08-27 US claimed