SCHEMBL13320286

SCHEMBL13320286

Cc1ccc(C(=O)c2ccc(N3C(=O)c4ccc(C(=O)Oc5ccc(OC(=O)c6ccc7c(c6)C(=O)N(C)C7=O)cc5)cc4C3=O)cc2)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FNTA P49354 1/20 0.57
FNTB P49356 1/20 0.57
ALDH1A1 P00352 4/20 0.54
CA9 Q16790 4/20 0.53
CA1 P00915 3/20 0.53
CA12 O43570 1/20 0.53
MET P08581 1/20 0.48
CA2 P00918 2/20 0.48
CA4 P22748 2/20 0.48
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
HSD17B10 Q99714 2/20 0.46
POLB P06746 2/20 0.45
HPGD P15428 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
HTT P42858 2/20 0.45
TSHR P16473 2/20 0.45
NPC1 O15118 1/20 0.45
CASP1 P29466 1/20 0.45
RAB9A P51151 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13320288 0.97 FNTA (0.54) FNTAFNTBALDH1A1CA9CA1
SCHEMBL12221390 0.96 FNTA (0.60) FNTAFNTBALDH1A1CA9CA1
SCHEMBL13320291 0.95 FNTA (0.54) FNTAFNTBALDH1A1CA9CA1
SCHEMBL12923693 0.93 FNTA (0.57) FNTAFNTBALDH1A1CA9CA1
SCHEMBL25627494 0.91 CA9 (0.55) FNTAFNTBALDH1A1CA9CA1
SCHEMBL29311928 0.88 CA9 (0.55) ALDH1A1CA9CA1CA12CA2
SCHEMBL12891172 0.88 CA9 (0.63) ALDH1A1CA9CA1CA12CA2
SCHEMBL13478270 0.87 CA9 (0.52) FNTAFNTBALDH1A1CA9CA1
SCHEMBL14877640 0.87 HSD17B10 (0.58) ALDH1A1CA9CA1CA12MET
SCHEMBL12891174 0.87 CA9 (0.56) ALDH1A1CA9CA1CA12CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-7438950-B2 Metallic pattern forming method and conductive pattern material FUJIFILM CORPORATION (JP) 2008-10-21 US disclosed