⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7091706 | 0.83 | — | — | |
| SCHEMBL7790898 | 0.83 | — | — | |
| SCHEMBL10494807 | 0.75 | PTPN1 (0.30) | — | |
| SCHEMBL29195534 | 0.69 | — | — | |
| SCHEMBL3486070 | 0.67 | — | — | |
| SCHEMBL1142629 | 0.66 | — | — | |
| SCHEMBL28472610 | 0.65 | — | — | |
| SCHEMBL15090549 | 0.65 | — | — | |
| SCHEMBL1198132 | 0.64 | POLB (0.30) | — | |
| SCHEMBL5789431 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2204484-B1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | KANEKA CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-9617669-B2 | Method of making polyimide fiber assembly | KANEKA CORPORATION (JP) | 2017-04-11 | — | — | US | disclosed |
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100229517-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, THERMAL INSULATING MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT RESISTANT BAG FILTER | KANEKA CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| EP-2204484-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | Kaneka Corporation (JP) | 2010-07-07 | — | — | EP | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-6689899-B2 | HYDROGENATION OF THE CORRESPONDING DINITRO COMPOUNDS | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2004-02-10 | — | — | US | disclosed |
| US-6642393-B2 | Such as 2,5-(dihydroxybenzenecarboxylic octane)-dibenzoate-3,3',4,4' -tetracarboxylic acid anhydride for producing polyimides or polyamic acides having low water absorption; for use in cosmetics, aeronautics, and electronics | KANEKA CORPORATION (JP) | 2003-11-04 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20020055610-A1 | Novel polyimide compositions and novel acid dianhydrides to be used therein | KANEKA CORPORATION (JP) | 2002-05-09 | — | — | US | disclosed |
| US-6350845-B1 | POLYAMIDEIMIDE COPOLYMERS FOR NONABSORBENT HEAT RESISTANT COMPOSITIONS | KANEKA CORPORATION (JP) | 2002-02-26 | — | — | US | disclosed |
| US-20020019558-A1 | Diamine and acid anhydride | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2002-02-14 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-6303742-B1 | CHARACTERIZED BY A CINNAMOYL GROUP OR A DERIVED CINNAMOYL GROUP INCORPORATED THEREIN AND BY PHOTO-REACTIVITY AND HEAT-REACTIVITY WHICH ARE INHERENT IN THE CINNAMOYL GROUP. | KANEKAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2001-10-16 | — | — | US | disclosed |