Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.80 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL135019 | 1.00 | — | — | |
| Methyl Alcohol SCHEMBL2170375 | 0.90 | — | — | |
| SCHEMBL2020 | 0.89 | — | — | |
| SCHEMBL1332279 | 0.89 | — | — | |
| Bicarbonate SCHEMBL8871100 | 0.88 | TDP1 (0.61) | TDP1ALDH1A1LMNATP53GAA | |
| Methyl Alcohol SCHEMBL21933067 | 0.86 | TDP1 (0.73) | TDP1ALDH1A1LMNA | |
| Isopropyl Alcohol SCHEMBL11224772 | 0.86 | TDP1 (0.73) | TDP1ALDH1A1LMNA | |
| Bicarbonate SCHEMBL20542224 | 0.84 | TDP1 (0.57) | TDP1ALDH1A1LMNATP53GAA | |
| Oxalic Acid SCHEMBL21145223 | 0.84 | TDP1 (0.57) | TDP1ALDH1A1TP53GAA | |
| Oxalic Acid SCHEMBL21145225 | 0.84 | TDP1 (0.57) | TDP1ALDH1A1TP53GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115162044-B | Method for producing paper or board | 索理思科技开曼公司 | 2024-02-23 | — | — | CN | disclosed |
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| EP-3238238-B1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO KGAA (DE) | 2020-10-28 | — | — | EP | disclosed |
| EP-3708389-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | Moon, Dae Yong (KR) | 2020-09-16 | — | — | EP | disclosed |
| US-20200262249-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | MUN DAE YONG (KR) | 2020-08-20 | — | — | US | disclosed |
| US-10446518-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2019-10-15 | — | — | US | disclosed |
| US-10141283-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2018-11-27 | — | — | US | disclosed |
| EP-3238238-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| EP-3238239-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| CN-102386149-B | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2014-12-03 | — | — | CN | disclosed |
| EP-2396140-B1 | METAL PASTE WITH OXIDATION AGENTS | HERAEUS MATERIALS TECH GMBH (DE) | 2013-01-16 | — | — | EP | disclosed |
| CN-102596486-A | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2012-07-18 | — | — | CN | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| CN-102386149-A | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2012-03-21 | — | — | CN | disclosed |
| EP-2428293-A2 | Contacting medium and process for contacting electrical parts | Heraeus Materials Technology GmbH & Co. KG (DE) | 2012-03-14 | — | — | EP | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |
| WO-2011026623-A1 | METAL PASTE WITH OXIDATION AGENTS | W. C. HERAEUS GMBH (DE) | 2011-03-10 | — | — | WO | disclosed |