SCHEMBL135477

SCHEMBL135477

[Ta].[TeH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28824504 0.82
SCHEMBL20398766 0.82
SCHEMBL28059972 0.82
SCHEMBL29204280 0.82
SCHEMBL21855296 0.82
SCHEMBL25264914 0.82
SCHEMBL15662 0.71
SCHEMBL8437155 0.71
SCHEMBL8435900 0.71
SCHEMBL2422998 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120058470-A1 ELECTRICAL WIRING OF POLYNUCLEOTIDES FOR NANOELECTRONIC APPLICATIONS UNIVERSITY OF SOUTHERN CALIFORNIA (US) 2012-03-08 US claimed
CN-102257648-A Bulk-processed, enhanced figure-of-merit thermoelectric materials CARRIER CORP 2011-11-23 CN claimed
WO-2010132727-A1 ELECTRICAL WIRING OF POLYNUCLEOTIDES FOR NANOELECTRONIC APPLICATIONS UNIVERSITY OF SOUTHERN CALIFORNIA (US) 2010-11-18 WO claimed
US-6866799-B2 Water-soluble electrically conductive composition, modifications, and applications thereof ANUVU, INC. (US) 2005-03-15 US claimed
WO-2020068720-A1 DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2020-04-02 WO disclosed
US-10181560-B2 Conductive-bridging random access memory and method for fabricating the same WINBOND ELECTRONICS CORP. (TW) 2019-01-15 US disclosed
CN-108400237-A Conductive bridge formula random access memory and its manufacturing method 华邦电子股份有限公司 2018-08-14 CN disclosed
US-20180212143-A1 CONDUCTIVE-BRIDGING RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME WINBOND ELECTRONICS CORP. (TW) 2018-07-26 US disclosed
US-20170059984-A1 PHOTOMASK CLEANING APPARATUS, METHOD OF CLEANING A PHOTOMASK, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD (KR) 2017-03-02 US disclosed
US-20120058470-A1 ELECTRICAL WIRING OF POLYNUCLEOTIDES FOR NANOELECTRONIC APPLICATIONS UNIVERSITY OF SOUTHERN CALIFORNIA (US) 2012-03-08 US disclosed
CN-102257648-A Bulk-processed, enhanced figure-of-merit thermoelectric materials CARRIER CORP 2011-11-23 CN disclosed
WO-2010132727-A1 ELECTRICAL WIRING OF POLYNUCLEOTIDES FOR NANOELECTRONIC APPLICATIONS UNIVERSITY OF SOUTHERN CALIFORNIA (US) 2010-11-18 WO disclosed