SCHEMBL1356972

SCHEMBL1356972

C=CC(=O)OCCCCC1CCC2OC2C1

nearest known ligand 0.49

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.49
ALDH1A1 P00352 3/20 0.49
CYP3A4 P08684 1/20 0.49
HPGD P15428 1/20 0.41
NAAA Q02083 12/20 0.38
TP53 P04637 2/20 0.38
HIF1A Q16665 2/20 0.38
HSD17B10 Q99714 1/20 0.38
EPHX1 P07099 1/20 0.37
ASAH1 Q13510 2/20 0.36
THRB P10828 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1355184 0.99 TSHR (0.51) TSHRALDH1A1CYP3A4HPGDNAAA
SCHEMBL1357910 0.96 TSHR (0.46) TSHRALDH1A1CYP3A4HPGDNAAA
SCHEMBL1356687 0.90 TSHR (0.41) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL17281229 0.88 TSHR (0.47) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL195745 0.81 TSHR (0.35) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL1357015 0.80 TSHR (0.45) TSHRALDH1A1NAAAEPHX1ASAH1
SCHEMBL19844245 0.79 TSHR (0.58) TSHRALDH1A1CYP3A4HPGDNAAA
SCHEMBL7533400 0.78 TSHR (0.61) TSHRALDH1A1CYP3A4HPGDNAAA
SCHEMBL17368859 0.78 TSHR (0.48) TSHRALDH1A1NAAAEPHX1ASAH1
SCHEMBL1355028 0.78 TSHR (0.48) TSHRALDH1A1NAAAEPHX1ASAH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4502077-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-02-05 EP disclosed
WO-2023190456-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2023-10-05 WO disclosed
CN-104726032-B Adhesive film, dicing die-bonding film, method for manufacturing semiconductor device, and semiconductor device 日东电工株式会社 2020-08-11 CN disclosed
US-20110281040-A1 LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF JSR CORPORATION (JP) 2011-11-17 US disclosed