SCHEMBL1360059

SCHEMBL1360059

CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.CCO[Zr]OCC

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.56
MGAM O43451 2/20 0.56
SI P14410 2/20 0.56
MGAM2 Q2M2H8 2/20 0.56
ALDH1A1 P00352 4/20 0.41
TRPA1 O75762 1/20 0.41
LMNA P02545 1/20 0.41
HSD17B10 Q99714 1/20 0.41
CYP1A2 P05177 1/20 0.36
ALOX15 P16050 2/20 0.34
SOAT1 P35610 1/20 0.34
KDM4E B2RXH2 1/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
TSHR P16473 1/20 0.34
MAPT P10636 2/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28104106 0.89 GAA (0.70) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL2582234 0.88 GAA (0.52) GAAMGAMSIMGAM2ALDH1A1
Water SCHEMBL25369189 0.87 GAA (0.67) GAAMGAMSIMGAM2ALDH1A1
Water SCHEMBL28668202 0.87 GAA (0.67) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1331371 0.87
SCHEMBL1330478 0.87
SCHEMBL1331762 0.87
SCHEMBL1871576 0.87 GAA (0.74) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1332259 0.87
SCHEMBL1331782 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884839-B2 Acetal-protected silanol group-containing polysiloxane composition NISSAN CHEMICAL CORPORATION (JP) 2024-01-30 US disclosed
EP-3514822-B1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2023-04-26 EP disclosed
US-11094899-B2 Method for manufacturing field effect transistor and method for manufacturing wireless communication device TORAY INDUSTRIES, INC. 2021-08-17 US disclosed
US-20210124266-A1 PRIMER FOR SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING A PATTERN NISSAN CHEMICAL CORPORATION (JP) 2021-04-29 US disclosed
US-10838303-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having carbonate skeleton NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-11-17 US disclosed
US-10613440-B2 Silicon-containing EUV resist underlayer film-forming composition containing onium sulfonate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-04-07 US disclosed
US-10558119-B2 Composition for coating resist pattern NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-02-11 US disclosed
US-10372040-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having halogen-containing carboxylic acid amide group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2019-08-06 US disclosed
EP-3514822-A1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE Toray Industries, Inc. (JP) 2019-07-24 EP disclosed
US-20190198786-A1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES, INC. (JP) 2019-06-27 US disclosed
US-6787193-B2 DECOMPOSITION OF AN ORGANOSILICON COMPOUND JSR CORPORATION (JP) 2004-09-07 US disclosed
US-6749944-B2 VAPOR DEPOSITION, OSCILLATION, HEATING USING ORGANOSILICON COMPOUND; FORMING DIELECTRIC JSR CORPORATION (JP) 2004-06-15 US disclosed
US-20030059550-A1 Method of film formation, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
US-20030059628-A1 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
EP-1296365-A2 Method of film formation, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030008155-A1 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR CORPORATION (JP) 2003-01-09 US disclosed
EP-1267395-A2 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR Corporation (JP) 2002-12-18 EP disclosed
US-6472079-B2 PRODUCT OF HYDROLYSIS AND CONDENSATION OF AN ORGANOSILICON COMPOUND; 1A OR 2A COMPOUND, ESPECIALLY CARBOXYLIC SALT; SOLVENT; EXCELLENT CRACKING RESISTANCE AFTER A PCT (PRESSURE COOKER TEST). JSR CORPORATION (JP) 2002-10-29 US disclosed
US-20020045693-A1 Composition for film formation, method of film formation and silica-based film JSR CORPORATION (JP) 2002-04-18 US disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed