SCHEMBL13601057

SCHEMBL13601057

O=C(Nc1ccccc1)c1cccc(-c2cccc(C(=O)Nc3ccccc3)c2)c1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC8 Q9BY41 2/20 0.71
HDAC1 Q13547 1/20 0.71
HDAC2 Q92769 1/20 0.71
HDAC6 Q9UBN7 1/20 0.71
NPC1 O15118 2/20 0.69
RAB9A P51151 2/20 0.69
SMN1; SMN2 Q16637 2/20 0.69
NR1H4 Q96RI1 1/20 0.69
ALDH1A1 P00352 1/20 0.69
HPGD P15428 1/20 0.69
TSHR P16473 1/20 0.69
KCNK3 O14649 1/20 0.69
KCNK9 Q9NPC2 1/20 0.69
SIRT1 Q96EB6 2/20 0.66
PTPN1 P18031 3/20 0.65
F2R P25116 1/20 0.64
PARP1 P09874 1/20 0.64
KMT2A Q03164 3/20 0.63
MEN1 O00255 2/20 0.63
POLB P06746 2/20 0.63

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2025738 0.98 NR1H4 (0.72) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL8745242 0.93 PTPN1 (0.77) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL18152289 0.93 MEN1 (0.73) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL27760395 0.93 PTPN1 (0.76) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL5943892 0.90 MEN1 (0.71) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL27984049 0.90 MEN1 (0.74) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL8374911 0.90 HDAC1 (0.85) HDAC8HDAC1HDAC2HDAC6NPC1
SCHEMBL18152442 0.89 MEN1 (0.69) NPC1RAB9ANR1H4HPGDKCNK3
SCHEMBL678664 0.88 MEN1 (0.75) NPC1RAB9ASMN1; SMN2NR1H4ALDH1A1
SCHEMBL5944034 0.87 PARP1 (0.86) HDAC8HDAC1HDAC2HDAC6SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed