Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 4/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.47 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.47 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.47 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.47 |
| ▸ | NPC1 | O15118 | 1/20 | 0.45 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.45 |
| ▸ | RAB9A | P51151 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.44 |
| ▸ | APEX1 | P27695 | 1/20 | 0.44 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.44 |
| ▸ | XDH | P47989 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | GALK1 | P51570 | 1/20 | 0.43 |
| ▸ | CASP6 | P55212 | 1/20 | 0.43 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.43 |
| ▸ | PLEC | Q15149 | 1/20 | 0.43 |
| ▸ | PYGL | P06737 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2488169 | 0.88 | POLB (0.52) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL28852244 | 0.88 | POLB (0.52) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL29958625 | 0.88 | POLB (0.52) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL29363335 | 0.88 | POLB (0.52) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL2270802 | 0.87 | POLB (0.58) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL29401261 | 0.87 | POLB (0.58) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL260857 | 0.87 | POLB (0.58) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL21437005 | 0.86 | POLB (0.56) | POLBALDH1A1HPSETDP1DUSP3 | |
| SCHEMBL21437004 | 0.86 | POLB (0.56) | POLBALDH1A1HPSETDP1DUSP3 | |
| Water SCHEMBL3777569 | 0.86 | POLB (0.56) | POLBALDH1A1HPSETDP1DUSP3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117500895-A | Adhesive composition, adhesive sheet, electromagnetic wave shielding material, laminate, and printed wiring board | 东洋纺MC株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-113286835-B | Adhesive composition containing dimeric alcohol copolymerized polyimide polyurethane resin | 东洋纺MC株式会社 | 2023-09-29 | — | — | CN | disclosed |
| WO-2020158360-A1 | ADHESIVE COMPOSITION CONTAINING A DIMER DIOL COPOLYMER POLYIMIDE URETHANE RESIN | 東洋紡株式会社 | 2020-08-06 | — | — | WO | disclosed |
| CN-106661198-B | Resin combination, prepreg, the metal foil of resin, metal-clad, printed wiring board | 松下知识产权经营株式会社 | 2019-08-06 | — | — | CN | disclosed |
| US-9604391-B2 | Laminate, production method for same, and method of creating device structure using laminate | TOYOBO CO., LTD. (JP) | 2017-03-28 | — | — | US | disclosed |
| US-8980409-B2 | Laminate, method for producing same, and method for producing device structure using same | TOYOBO CO., LTD. (JP) | 2015-03-17 | — | — | US | disclosed |
| US-8889250-B2 | Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them | KANEKA CORPORATION (JP) | 2014-11-18 | — | — | US | disclosed |
| US-20140042662-A1 | LAMINATE, PRODUCTION METHOD FOR SAME, AND METHOD OF CREATING DEVICE STRUCTURE USING LAMINATE | TOYOBO CO., LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-20140041800-A1 | LAMINATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING DEVICE STRUCTURE USING SAME | TOYOBO CO., LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-8501874-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2013-08-06 | — | — | US | disclosed |
| US-20070074896-A1 | Thermosetting resin composition, laminated body using it, and circuit board | KANEKA CORPORATION (JP) | 2007-04-05 | — | — | US | disclosed |
| US-20060205891-A1 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2006-09-14 | — | — | US | disclosed |
| EP-0957400-B1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN THEREFROM, ELECTRONIC DEVICES PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCTION THEREOF | HITACHI CHEMICAL CO LTD (JP) | 2003-04-16 | — | — | EP | disclosed |
| US-6291619-B1 | HEAT RESISTANCE | HITACHI CHEMICAL CO., LTD (JP) | 2001-09-18 | — | — | US | disclosed |
| EP-0957400-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN THEREFROM, ELECTRONIC DEVICES PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCTION THEREOF | HITACHI CHEMICAL CO., LTD. (JP) | 1999-11-17 | — | — | EP | disclosed |
| EP-0499986-B1 | Multilayer wiring structure and method for forming multilayer construction | HITACHI LTD (JP) | 1998-05-13 | — | — | EP | disclosed |
| US-5616448-A | Photosensitive resin composition and a process for forming a patterned polyimide film using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1997-04-01 | — | — | US | disclosed |
| US-5587275-A | POLYAMIC ACIDS COMPRISING DIAMINES WITH AN ACRYLOXY OR A METHACRYLOXY GROUP; STORAGE STABILITY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1996-12-24 | — | — | US | disclosed |
| US-5570506-A | POLYIMIDE WITH LOW THERMAL EXPANSION | HITACHI, LTD. (JP) | 1996-11-05 | — | — | US | disclosed |
| EP-0499986-A2 | Multilayer wiring structure and method for forming multilayer construction | HITACHI, LTD. (JP) | 1992-08-26 | — | — | EP | disclosed |