Ethylene

Ethylene

SCHEMBL1362591

C1=NCCN1.C1=NCCN1.C=C

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene SCHEMBL7700035 1.00
Ethylene SCHEMBL28477926 1.00
SCHEMBL71779 0.94
SCHEMBL9720250 0.94
SCHEMBL1018939 0.94
SCHEMBL9646 0.94
SCHEMBL10401525 0.90
SCHEMBL5694752 0.90
Ammonia Solution, Strong SCHEMBL209038 0.90
Ammonia Solution, Strong SCHEMBL16861381 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2480495-B1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION CYTEC TECH CORPORATION (US) 2018-11-14 EP claimed
EP-2101920-B1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECH CORP (US) 2017-02-22 EP claimed
US-9242863-B2 Process and reagents for the inhibition or reduction of scale formation during phosphoric acid production CYTEC TECHNOLOGY CORP. (US) 2016-01-26 US claimed
EP-2480495-A1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION Cytec Technology Corporation (US) 2012-08-01 EP claimed
US-8066885-B2 Process for the removal of impurities from carbonate minerals CYTEC TECHNOLOGY CORP. (US) 2011-11-29 US claimed
WO-2011038108-A1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION CYTEC TECHNOLOGY CORP. (US) 2011-03-31 WO claimed
US-20110076218-A1 Process and Reagents for the Inhibition or Reduction of Scale Formation During Phosphoric Acid Production CYTEC TECHNOLOGY CORP. (US) 2011-03-31 US claimed
US-20080164140-A1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECHNOLOGY CORP. 2008-07-10 US claimed
EP-2480495-B1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION CYTEC TECH CORPORATION (US) 2018-11-14 EP disclosed
EP-2101920-B1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECH CORP (US) 2017-02-22 EP disclosed
US-20160332916-A1 BENEFICIATING PROCESS IMERYS CERAMICS FRANCE (FR) 2016-11-17 US disclosed
EP-2990379-A1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION Cytec Technology Corp. (US) 2016-03-02 EP disclosed
US-9242863-B2 Process and reagents for the inhibition or reduction of scale formation during phosphoric acid production CYTEC TECHNOLOGY CORP. (US) 2016-01-26 US disclosed
EP-2480495-A1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION Cytec Technology Corporation (US) 2012-08-01 EP disclosed
US-8066885-B2 Process for the removal of impurities from carbonate minerals CYTEC TECHNOLOGY CORP. (US) 2011-11-29 US disclosed
WO-2011038108-A1 PROCESS AND REAGENTS FOR THE INHIBITION OR REDUCTION OF SCALE FORMATION DURING PHOSPHORIC ACID PRODUCTION CYTEC TECHNOLOGY CORP. (US) 2011-03-31 WO disclosed
US-20110076218-A1 Process and Reagents for the Inhibition or Reduction of Scale Formation During Phosphoric Acid Production CYTEC TECHNOLOGY CORP. (US) 2011-03-31 US disclosed
EP-2101920-A1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECHNOLOGY CORP. (US) 2009-09-23 EP disclosed
WO-2008085626-A1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECHNOLOGY CORP. (US) 2008-07-17 WO disclosed
US-20080164140-A1 PROCESS FOR THE REMOVAL OF IMPURITIES FROM CARBONATE MINERALS CYTEC TECHNOLOGY CORP. 2008-07-10 US disclosed