⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL136356 | 1.00 | PAOX (0.48) | — | |
| Methyl Alcohol SCHEMBL11581901 | 0.92 | PAOX (0.48) | — | |
| SCHEMBL15445 | 0.91 | — | — | |
| SCHEMBL17626634 | 0.91 | TSHR (0.53) | — | |
| Bicarbonate SCHEMBL28444878 | 0.89 | PAOX (0.54) | — | |
| Methyl Alcohol SCHEMBL11565826 | 0.88 | PAOX (0.46) | — | |
| Alcohol SCHEMBL10353696 | 0.88 | TSHR (0.46) | — | |
| Bromide SCHEMBL3468246 | 0.87 | — | — | |
| SCHEMBL6934656 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL21176007 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| EP-3238238-B1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO KGAA (DE) | 2020-10-28 | — | — | EP | disclosed |
| US-10446518-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2019-10-15 | — | — | US | disclosed |
| US-10141283-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2018-11-27 | — | — | US | disclosed |
| CN-107735854-A | Sinterable jointing material and use its semiconductor device | 汉高股份有限及两合公司 | 2018-02-23 | — | — | CN | disclosed |
| EP-3238238-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| EP-3238239-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| US-20170294396-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-12 | — | — | US | disclosed |
| US-20170294404-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-12 | — | — | US | disclosed |
| CN-107112246-A | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2017-08-29 | — | — | CN | disclosed |
| CN-102596486-B | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2015-06-24 | — | — | CN | disclosed |
| US-8950652-B2 | Metal paste with oxidizing agents | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-02-10 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| CN-102386149-B | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2014-12-03 | — | — | CN | disclosed |
| CN-102596486-A | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2012-07-18 | — | — | CN | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| CN-102386149-A | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2012-03-21 | — | — | CN | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |