⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22210632 | 0.87 | KDM4E (0.35) | — | |
| SCHEMBL3203981 | 0.87 | — | — | |
| SCHEMBL25973957 | 0.84 | — | — | |
| SCHEMBL25973938 | 0.84 | — | — | |
| SCHEMBL7906079 | 0.82 | CA1 (0.33) | — | |
| SCHEMBL4543413 | 0.82 | GSR (0.42) | — | |
| SCHEMBL13686302 | 0.80 | — | — | |
| SCHEMBL16318622 | 0.80 | GSR (0.44) | — | |
| SCHEMBL16318606 | 0.80 | GSR (0.44) | — | |
| SCHEMBL16318639 | 0.80 | GSR (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11915925-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| US-11915925-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| US-11710731-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2023-07-25 | — | — | US | disclosed |
| US-11710731-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2023-07-25 | — | — | US | disclosed |
| US-20210391165-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-12-16 | — | — | US | disclosed |
| US-20210384183-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-12-09 | — | — | US | disclosed |
| US-20210358884-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-11-18 | — | — | US | disclosed |
| US-10947425-B2 | Adhesive | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| WO-2020085259-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 株式会社ダイセル | 2020-04-30 | — | — | WO | disclosed |
| WO-2020085258-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 株式会社ダイセル | 2020-04-30 | — | — | WO | disclosed |
| WO-2020085256-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 株式会社ダイセル | 2020-04-30 | — | — | WO | disclosed |
| WO-2020085257-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 株式会社ダイセル | 2020-04-30 | — | — | WO | disclosed |
| US-20190119534-A1 | ADHESIVE | DAICEL CORPORATION (JP) | 2019-04-25 | — | — | US | disclosed |
| US-20160264822-A1 | ADHESIVE AGENT | DAICEL CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-20160264822-A1 | ADHESIVE AGENT | DAICEL CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-8822126-B2 | Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate | FUJIFILM CORPORATION (JP) | 2014-09-02 | — | — | US | disclosed |
| US-8822126-B2 | Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate | FUJIFILM CORPORATION (JP) | 2014-09-02 | — | — | US | disclosed |
| US-20090220752-A1 | Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate | FUJIFILM CORPORATION (JP) | 2009-09-03 | — | — | US | disclosed |