SCHEMBL137000

SCHEMBL137000

CC(C)(C)OC(=O)N(CCCCCCN(C(=O)OC(C)(C)C)C(=O)OC(C)(C)C)C(=O)OC(C)(C)C

nearest known ligand 0.46

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HDAC6 Q9UBN7 2/20 0.46
HDAC1 Q13547 1/20 0.46
HDAC2 Q92769 1/20 0.46
CA14 Q9ULX7 2/20 0.45
L3MBTL1 Q9Y468 4/20 0.40
TDP1 Q9NUW8 1/20 0.37
DGAT1 O75907 1/20 0.37
CPB2 Q96IY4 7/20 0.35
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA7 P43166 1/20 0.34
MAOA P21397 1/20 0.33
MAOB P27338 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25969651 0.92 HDAC1 (0.41) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL21010750 0.92 HDAC1 (0.41) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL30324862 0.92 TDP1 (0.49) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL30772617 0.92 TDP1 (0.49) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL14802528 0.92 HDAC1 (0.41) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL3453056 0.92 TDP1 (0.49) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL8736769 0.92 HDAC1 (0.41) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL1906455 0.90 HDAC6 (0.40) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL5360201 0.90 HDAC6 (0.40) HDAC6HDAC1HDAC2CA14L3MBTL1
SCHEMBL14411779 0.90 HDAC6 (0.40) HDAC6HDAC1HDAC2CA14L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 325 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12306538-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2025-05-20 US disclosed
US-11681222-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2023-06-20 US disclosed
US-11453734-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2022-09-27 US disclosed
US-20220137508-A9 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2022-05-05 US disclosed
US-20210278764-A1 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2021-09-09 US disclosed
US-20210200097-A1 TREATMENT LIQUID AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2021-07-01 US disclosed
US-11042094-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2021-06-22 US disclosed
US-11036133-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2021-06-15 US disclosed
US-10962884-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2021-03-30 US disclosed
EP-2414896-B1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-1225480-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-07-24 EP disclosed
US-20020090569-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-07-11 US disclosed
US-20020012872-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-31 US disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1164433-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1162506-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-12 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed