Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1372581 | 0.82 | TSHR (0.30) | TSHR | |
| SCHEMBL1375044 | 0.81 | — | — | |
| SCHEMBL484971 | 0.79 | TSHR (0.45) | TSHR | |
| SCHEMBL5179633 | 0.79 | TSHR (0.45) | TSHR | |
| SCHEMBL4210062 | 0.78 | — | — | |
| SCHEMBL1375046 | 0.77 | TSHR (0.30) | TSHR | |
| SCHEMBL11054576 | 0.76 | — | — | |
| SCHEMBL15884102 | 0.75 | — | — | |
| SCHEMBL11057553 | 0.74 | — | — | |
| SCHEMBL11802230 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3284771-B1 | HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT | TORAY INDUSTRIES (JP) | 2023-08-30 | — | — | EP | disclosed |
| US-10365559-B2 | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-07-30 | — | — | US | disclosed |
| EP-3284771-A1 | HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT | Toray Industries, Inc. (JP) | 2018-02-21 | — | — | EP | disclosed |
| US-20180031970-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| EP-3267254-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| US-8895676-B2 | Resin composition and display device using the same | TORAY INDUSTRIES, INC. (JP) | 2014-11-25 | — | — | US | disclosed |
| US-20140191222-A1 | RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2014-07-10 | — | — | US | disclosed |
| US-8709552-B2 | Resin composition and display device using the same | TORAY INDUSTRIES, INC. (JP) | 2014-04-29 | — | — | US | disclosed |
| CN-102227474-B | Resin composition and display device formed using same | TORAY INDUSTRIES | 2013-11-06 | — | — | CN | disclosed |
| US-20110284855-A1 | RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2011-11-24 | — | — | US | disclosed |