SCHEMBL1398019

SCHEMBL1398019

O=C1C=C(CCC2=CC(=O)NC2=O)C(=O)N1

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 1/20 0.32
GSK3B P49841 1/20 0.32
CCR6 P51684 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28158179 0.97 GSK3A (0.30) GSK3AGSK3BCCR6
SCHEMBL548121 0.90 STAT3 (0.35)
SCHEMBL5703319 0.90 STAT3 (0.31)
SCHEMBL548131 0.87 STAT3 (0.39)
SCHEMBL10428730 0.87 STAT3 (0.39)
SCHEMBL10428620 0.87 STAT3 (0.39)
SCHEMBL586641 0.87 STAT3 (0.39)
SCHEMBL549041 0.87 STAT3 (0.39)
SCHEMBL6910095 0.87 STAT3 (0.39)
SCHEMBL549066 0.87 STAT3 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 330 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119490747-A Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board 广东生益科技股份有限公司 2025-02-21 CN claimed
CN-119431678-A Flame retardant composition 长春人造树脂厂股份有限公司 2025-02-14 CN claimed
CN-116410596-B Resin composition and application thereof 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-116410595-B Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 CN claimed
CN-117624837-A Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2024-03-01 CN claimed
CN-111690247-B Resin composition and use thereof 台燿科技股份有限公司 2024-01-02 CN claimed
EP-4225811-A1 POLYMER PARTICLES Queensland University Of Technology (AU) 2023-08-16 EP claimed
JP-2009504844-A 2009-02-05 JP claimed
EP-1924641-A1 FLAME RETARDED STYRENIC POLYMER FOAMS AND FOAM PRECURSORS Albermarle Corporation (US) 2008-05-28 EP claimed
WO-2007019120-A1 FLAME RETARDED STYRENIC POLYMER FOAMS AND FOAM PRECURSORS ALBEMARLE CORPORATION (US) 2007-02-15 WO claimed
WO-1993025386-A1 THERMALLY RESISTANT GLASS ARTICLE ENSIGN-BICKFORD COATINGS COMPANY (US) 1993-12-23 WO claimed
EP-0378457-A2 Aromatic allyl amine thermosetting resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-07-18 EP claimed
US-4942093-A COMPOSITES, THERMOSETTING RESINS, A BISMALEIMIDE COMPOUND AND AN ISOCYANATE TERMINATED RUBBER BONDED TO A POLYURETHANES, TIR ES BRIDGESTONE/FIRESTONE, INC. (US) 1990-07-17 US claimed
US-4933385-A HAVING EXCELLENT ADHESION TO STEEL CORDS, CONTAINING A COBALT OXYKETONE COMPLEX AND A BISMALEIMIDE COMPOUND; TIRES HOSES, BELTS; HEAT RESISTANCE BRIDGESTONE CORPORATION (JP) 1990-06-12 US claimed
EP-0358084-A2 An adhesive system for bonding uncured rubber to cured polyurethane BRIDGESTONE/FIRESTONE, INC. (US) 1990-03-14 EP claimed
EP-0202498-A2 Use of a thermo-setting, polymerizable composition and wiring board HITACHI, LTD. (JP) 1986-11-26 EP claimed
EP-0086837-A1 VIBRATING PLATE FOR SPEAKER TORAY INDUSTRIES, INC. (JP) 1983-08-31 EP claimed