SCHEMBL140973

SCHEMBL140973

[Dy+3].[N-3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Strontium SCHEMBL29363795 0.71
SCHEMBL29484462 0.71
SCHEMBL30683370 0.71
Water SCHEMBL29393265 0.71
Strontium SCHEMBL31398485 0.71
Strontium SCHEMBL29710909 0.71
Strontium SCHEMBL29846146 0.71
SCHEMBL29538745 0.71
Strontium SCHEMBL29349407 0.71
SCHEMBL28800223 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 171 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026043378-A1 METHODS AND SYSTEMS FOR PRODUCING AMMONIA SYNTHESIS CATALYSTS NATALI FRANCK (NZ) 2026-02-26 WO claimed
WO-2025096520-A1 NEUTRON GENERATION TARGET MATERIALS, CONFIGURATIONS AND METHODS FOR IMPROVED PROTECTION OF OBJECTIVE MATERIALS AND METHODS OF PRODUCING NEUTRONS WITH THE SAME TAE TECHNOLOGIES, INC. (US) 2025-05-08 WO claimed
CN-119657191-A Composite nitride catalyst, preparation method and application 中国科学院大连化学物理研究所 2025-03-21 CN claimed
CN-115101281-B High-coercivity neodymium-iron-boron magnetic material and preparation method thereof 宁波合力磁材技术有限公司 2025-03-07 CN claimed
CN-118179554-A Composite catalyst and preparation method and application thereof 中国科学院大连化学物理研究所 2024-06-14 CN claimed
CN-117766864-A Lithium metal battery, preparation method and power utilization device 蜂巢能源科技股份有限公司 2024-03-26 CN claimed
CN-112635145-B Preparation method of composite magnetic powder 中国计量大学 2024-03-05 CN claimed
CN-110831899-B Ammonia production method and device for ammonia production 维多利亚联科有限公司 2023-05-26 CN claimed
US-11498844-B2 Ammonia production method and apparatus for ammonia production VICTORIA LINK LIMITED (NZ) 2022-11-15 US claimed
CN-112362705-B Preparation method of molecularly imprinted composite paste electrode sensor for detecting ribavirin 内蒙古科技大学 2022-09-30 CN claimed
US-7601430-B2 biaxially oriented intermediate oxide or nitride layer disposed over polyimide substrate; a buffer layer epitaxially grown on the intermediate layer; a semiconducting active layer disposed over buffer layer, Y2O3 anucleation layer disposed between substrate and intermediate; photovoltic cells LOS ALAMOS NATIONAL SECURITY, LLC (US) 2009-10-13 US claimed
US-20090214859-A1 BIAXIALLY ORIENTED FILM ON FLEXIBLE POLYMERIC SUBSTRATE THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2009-08-27 US claimed
US-20090123735-A1 LOW CONTAMINATION COMPONENTS FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR MAKING COMPONENTS LAM RESEARCH CORPORATION (US) 2009-05-14 US claimed
US-20090068845-A1 Low contamination components for semiconductor processing apparatus and methods for making components LAM RESEARCH CORPORATION (US) 2009-03-12 US claimed
WO-2007089886-A2 BIAXIALLY ORIENTED FILM ON FLEXIBLE POLYMERIC SUBSTRATE LOS ALAMOS NATIONAL SECURITY, LLC (US) 2007-08-09 WO claimed
EP-1495155-A1 LOW CONTAMINATION COMPONENTS FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR MAKING COMPONENTS LAM RESEARCH CORPORATION (US) 2005-01-12 EP claimed
US-20050003240-A1 Low contamination components for semiconductor processing apparatus and methods for making components LAM RESEARCH CORPORATION 2005-01-06 US claimed
US-6780787-B2 Low contamination components for semiconductor processing apparatus and methods for making components LAM RESEARCH CORPORATION 2004-08-24 US claimed
WO-2003080892-A1 LOW CONTAMINATION COMPONENTS FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR MAKING COMPONENTS LAM RESEARCH CORPORATION (US) 2003-10-02 WO claimed
US-20030181065-A1 Low contamination components for semiconductor processing apparatus and methods for making components LAM RESEARCH CORPORATION 2003-09-25 US claimed