SCHEMBL142138

SCHEMBL142138

CC(C(=O)NN)[C@H](N)C(=O)NN

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 1/20 0.43
SLC7A5 Q01650 1/20 0.36
DPP4 P27487 2/20 0.35
FAP Q12884 1/20 0.35
DPP8 Q6V1X1 1/20 0.35
DPP9 Q86TI2 1/20 0.35
DPP7 Q9UHL4 1/20 0.35
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
ALDH1A1 P00352 2/20 0.33
CTSD P07339 1/20 0.32
CYP1A2 P05177 1/20 0.32
TSHR P16473 1/20 0.32
NFKB1 P19838 1/20 0.32
MAOA P21397 1/20 0.32
MAOB P27338 1/20 0.32
THPO P40225 1/20 0.32
GAA P10253 1/20 0.32
OGG1 O15527 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18334295 0.83 HIF1A (0.53) HIF1ASLC7A5DPP4FAPDPP8
SCHEMBL9651230 0.81
SCHEMBL9651237 0.81
SCHEMBL25221983 0.79
SCHEMBL25221985 0.79
SCHEMBL18099906 0.78
SCHEMBL11018757 0.78
SCHEMBL8053691 0.76
SCHEMBL2211759 0.75
SCHEMBL29288139 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023208534-A1 AMINE-FUNCTIONALIZED POLY(ARYLENE SULFIDE) POLYMER SOLVAY SPECIALTY POLYMERS USA, LLC (US) 2023-11-02 WO claimed
CN-109913025-B Aqueous dispersions of microspheroidal phosphoric acid functionalized polymer particles 陶氏环球技术有限责任公司 2023-03-17 CN claimed
US-20230081047-A1 THREE-DIMENSIONAL PRINTING KITS WITH DIHYDRAZIDES HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2023-03-16 US claimed
EP-3681922-B1 RADIATION CURABLE AQUEOUS COMPOSITIONS ALLNEX Belgium SA (BE) 2022-12-07 EP claimed
CN-115151404-A Three-dimensional printing set containing dihydrazide 惠普发展公司,有限责任合伙企业 2022-10-04 CN claimed
EP-3778738-B1 THERMALLY EXPANDABLE COMPOSITIONS COMPRISING A CHEMICAL BLOWING AGENT SIKA TECH AG (CH) 2022-06-08 EP claimed
US-11312868-B2 Aqueous dispersion of microspheres p-acid functionalized polymer particles ROHM AND HAAS COMPANY (US) 2022-04-26 US claimed
CN-111094379-B Radiation curable aqueous compositions 湛新比利时股份有限公司 2022-04-01 CN claimed
US-20210309881-A1 LOW APPLICATION TEMPERATURE POWDER COATING SWIMC LLC (US) 2021-10-07 US claimed
WO-2021183116-A1 THREE-DIMENSIONAL PRINTING KITS WITH DIHYDRAZIDES HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-09-16 WO claimed
US-20120296009-A1 SYNTACTIC FOAM HEXCEL COMPOSITES LIMITED (GB) 2012-11-22 US claimed
EP-2496627-A2 SYNTACTIC FOAM Hexcel Composites Limited (GB) 2012-09-12 EP claimed
WO-2011055141-A2 SYNTACTIC FOAM HEXCEL COMPOSITES LIMITED (GB) 2011-05-12 WO claimed
EP-2246403-A1 Waterborne adhesive formulations Akzo Nobel Coatings International B.V. (NL) 2010-11-03 EP claimed
US-20090053965-A1 METHOD FOR MANUFACTURING DISPLAY DEVICE AND COMPOSITION OF SEALANT THEREFOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-02-26 US claimed
US-6723803-B1 STABLE AT ROOM TEMPERATURE; ONE-COMPONENT RAYTHEON COMPANY 2004-04-20 US claimed
EP-0754742-B1 Room-temperature stable, one-component, flexible epoxy adhesives RAYTHEON CO (US) 2001-10-24 EP claimed
EP-0759462-A2 Flexible electrically-conductive epoxy adhesives HE HOLDINGS, INC. dba HUGHES ELECTRONICS (US) 1997-02-26 EP claimed
EP-0754742-A2 Room-temperature stable, one-component, flexible epoxy adhesives HE HOLDINGS, INC. dba HUGHES ELECTRONICS (US) 1997-01-22 EP claimed
US-5575956-A Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives HUGHES AIRCRAFT COMPANY (US) 1996-11-19 US claimed