SCHEMBL14401010

SCHEMBL14401010

CCC(C)(CC)n1c(=O)c2cc3c(=O)n(-c4ccc(Oc5ccc(C(C)(C)C)cc5)cc4)c(=O)c3cc2c1=O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 4/20 0.40
▸ NPC1 O15118 3/20 0.38
▸ RAB9A P51151 3/20 0.38
▸ ALDH1A1 P00352 2/20 0.38
▸ HPGD P15428 2/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ NPBWR1 P48145 1/20 0.37
▸ MCHR1 Q99705 1/20 0.37
▸ LMNA P02545 1/20 0.37
▸ CYP2C9 P11712 3/20 0.36
▸ CYP2C19 P33261 2/20 0.36
▸ PPARG P37231 5/20 0.36
▸ PPARA Q07869 2/20 0.35
▸ MMP14 P50281 1/20 0.35
▸ CA12 O43570 1/20 0.35
▸ CA1 P00915 1/20 0.35
▸ CA2 P00918 1/20 0.35
▸ CA9 Q16790 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.34
▸ POLB P06746 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13866453 0.92 CA12 (0.40) MAPTMAPK1LMNACYP2C9CYP2C19
SCHEMBL24284449 0.91 NPC1 (0.46) MAPTNPC1RAB9AALDH1A1MAPK1
SCHEMBL17298641 0.91 MAPT (0.39) MAPTNPC1RAB9AALDH1A1NPBWR1
SCHEMBL18823083 0.87 MAPT (0.41) MAPTNPC1RAB9AALDH1A1HPGD
SCHEMBL13536941 0.84 NPC1 (0.44) MAPTNPC1RAB9ALMNACYP2C9
SCHEMBL19011462 0.83 MAPT (0.42) MAPTNPC1RAB9AALDH1A1HPGD
SCHEMBL14116424 0.83 CA12 (0.39) MAPTMAPK1LMNACA12CA1
SCHEMBL23951147 0.81 NPC1 (0.46) MAPTNPC1RAB9AALDH1A1MAPK1
SCHEMBL13151640 0.81 MAPT (0.41) MAPTNPC1RAB9AALDH1A1HPGD
SCHEMBL15457961 0.80 SMN1; SMN2 (0.43) MAPTNPC1RAB9AALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7285306-B1 Process for self-repair of insulation material UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2007-10-23 — — US disclosed
US-20070066090-A1 Wiring board, process for producing the same polyimide film for use in the wiring board, and etchant for use in the process KANEKA CORPORATION (JP) 2007-03-22 — — US disclosed
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