Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | SHBG | P04278 | 1/20 | 0.33 |
| ▸ | ADH1A | P07327 | 1/20 | 0.30 |
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
| ▸ | CA2 | P00918 | 1/20 | 0.30 |
| ▸ | CA4 | P22748 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12504134 | 0.97 | — | — | |
| SCHEMBL825769 | 0.85 | CYP1A2 (0.44) | CYP1A2SHBG | |
| SCHEMBL28154555 | 0.83 | CYP1A2 (0.43) | CYP1A2 | |
| SCHEMBL15914976 | 0.82 | CYP1A2 (0.41) | CYP1A2 | |
| SCHEMBL15914442 | 0.81 | CYP1A2 (0.41) | CYP1A2 | |
| SCHEMBL15915126 | 0.78 | CYP1A2 (0.38) | CYP1A2 | |
| SCHEMBL1450645 | 0.78 | — | — | |
| SCHEMBL9012015 | 0.75 | — | — | |
| SCHEMBL29101865 | 0.73 | POLB (0.33) | CYP1A2 | |
| SCHEMBL8476970 | 0.69 | TLR4 (0.37) | CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2658877-B1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORP (JP) | 2023-04-12 | — | — | EP | disclosed |
| US-9970103-B2 | Film deposition material, sealing film using the same and use thereof | TOSOH CORPORATION (JP) | 2018-05-15 | — | — | US | disclosed |
| CN-103781937-B | Filmogen, the diaphragm seal using the filmogen, and application thereof | 东曹株式会社 | 2017-05-31 | — | — | CN | disclosed |
| US-9546237-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2017-01-17 | — | — | US | disclosed |
| US-9499683-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2016-11-22 | — | — | US | disclosed |
| US-20160326642-A1 | FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF | TOSOH CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| US-20140219903-A1 | FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF | TOSOH CORPORATION (JP) | 2014-08-07 | — | — | US | disclosed |
| CN-103781937-A | Film-forming material, sealing film using same, and use of sealing film | TOSOH CORP | 2014-05-07 | — | — | CN | disclosed |
| US-20140031471-A1 | Stabilization Of Polymers That Contain A Hydrolyzable Functionality | BRIDGESTONE CORPORATION (JP) | 2014-01-30 | — | — | US | disclosed |
| US-20130331520-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORPORATION (JP) | 2013-12-12 | — | — | US | disclosed |
| EP-2658877-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | Bridgestone Corporation (JP) | 2013-11-06 | — | — | EP | disclosed |
| WO-2012092626-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORPORATION (JP) | 2012-07-05 | — | — | WO | disclosed |
| US-7910897-B2 | Process and apparatus for post deposition treatment of low dielectric materials | APPLIED MATERIALS, INC. (US) | 2011-03-22 | — | — | US | disclosed |
| US-20080042077-A1 | PROCESS AND APPARATUS FOR POST DEPOSITION TREATMENT OF LOW DIELECTRIC MATERIALS | APPLIED MATERIALS, IN.C | 2008-02-21 | — | — | US | disclosed |
| US-7288205-B2 | Hermetic low dielectric constant layer for barrier applications | APPLIED MATERIALS, INC. (US) | 2007-10-30 | — | — | US | disclosed |
| US-7091137-B2 | Bi-layer approach for a hermetic low dielectric constant layer for barrier applications | APPLIED MATERIALS (US) | 2006-08-15 | — | — | US | disclosed |
| US-20060006140-A1 | Hermetic low dielectric constant layer for barrier applications | APPLIED MATERIALS, INC. | 2006-01-12 | — | — | US | disclosed |
| US-20050277302-A1 | Advanced low dielectric constant barrier layers | APPLIED MATERIALS, INC. | 2005-12-15 | — | — | US | disclosed |
| US-20050250346-A1 | Process and apparatus for post deposition treatment of low k dielectric materials | APPLIED MATERIALS, INC. | 2005-11-10 | — | — | US | disclosed |
| US-20050042889-A1 | Bi-layer approach for a hermetic low dielectric constant layer for barrier applications | APPLIED MATERIALS, INC. | 2005-02-24 | — | — | US | disclosed |