SCHEMBL14536626

SCHEMBL14536626

CC1=CC=CC=C(O)C1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21417149 0.66
SCHEMBL30438883 0.62
SCHEMBL27278677 0.62
SCHEMBL27395751 0.62
SCHEMBL10083910 0.58
SCHEMBL13074023 0.58
SCHEMBL8650182 0.57
SCHEMBL13214474 0.56
SCHEMBL13214614 0.56
SCHEMBL9965110 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1785441-A1 EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-05-16 EP disclosed