Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.75 |
| ▸ | MEN1 | O00255 | 3/20 | 0.58 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.58 |
| ▸ | THRB | P10828 | 1/20 | 0.58 |
| ▸ | HTT | P42858 | 1/20 | 0.58 |
| ▸ | MAPT | P10636 | 1/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | USP2 | O75604 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.39 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.39 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylene Glycol SCHEMBL986168 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL8636269 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL1147464 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL220582 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL988077 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL23499010 | 1.00 | TSHR (0.75) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL11564762 | 0.95 | TSHR (0.68) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL23356849 | 0.95 | TSHR (0.68) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL23356752 | 0.95 | TSHR (0.68) | TSHRMEN1KMT2ATHRBHTT | |
| Ethylene Glycol SCHEMBL18784039 | 0.94 | TSHR (0.83) | TSHRMEN1KMT2ATHRBHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119387948-A | Cleaning-free low-residue soldering paste and preparation method thereof | 深圳市绿色千田锡业科技有限公司 | 2025-02-07 | — | — | CN | claimed |
| US-20230001348-A1 | NON-AQUEOUS SOLVENT FOR REMOVING ACIDIC GAS FROM A PROCESS GAS STREAM FOR HIGH PRESSURE APPLICATIONS | RESEARCH TRIANGLE INSTITUTE | 2023-01-05 | — | — | US | claimed |
| US-20220355422-A1 | LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOLDER MATERIAL, AND METHOD OF FORMING A LAYER STRUCTURE | INFINEON TECHNOLOGIES AG (DE) | 2022-11-10 | — | — | US | claimed |
| CN-115229381-A | Lead-free solder material, layer structure, method of forming solder material and layer structure | 英飞凌科技股份有限公司 | 2022-10-25 | — | — | CN | claimed |
| EP-4072703-A1 | NON-AQUEOUS SOLVENT FOR REMOVING ACIDIC GAS FROM A PROCESS GAS STREAM FOR HIGH PRESSURE APPLICATIONS | Research Triangle Institute (US) | 2022-10-19 | — | — | EP | claimed |
| WO-2021119058-A1 | NON-AQUEOUS SOLVENT FOR REMOVING ACIDIC GAS FROM A PROCESS GAS STREAM FOR HIGH PRESSURE APPLICATIONS | RESEARCH TRIANGLE INSTITUTE (US) | 2021-06-17 | — | — | WO | claimed |
| EP-2038086-B1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2015-02-25 | — | — | EP | claimed |
| US-7767032-B2 | alloy powder dispersed in a flux mixture comprising a low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers; for die-attach dispensing or fine pitch printing; homogeneity; without prior cleaning | W.C. Heraeus Holding GmbH (DE) | 2010-08-03 | — | — | US | claimed |
| EP-2038086-A1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | Umicore AG & Co. KG (DE) | 2009-03-25 | — | — | EP | claimed |
| US-20080000549-A1 | No-clean low-residue solder paste for semiconductor device applications | UMICORE AG & CO. KG (DE) | 2008-01-03 | — | — | US | claimed |
| WO-2008000349-A1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | UMICORE AG & CO. KG (DE) | 2008-01-03 | — | — | WO | claimed |
| US-4075830-A | Solid adhesive compositions | KONISHI CO., LTD. (JA) | 1978-02-28 | — | — | US | claimed |
| US-4073756-A | WAX-LIKE OR JELLY-LIKE AT ROOM TEMPERATURE | KONISHI CO., LTD. (JA) | 1978-02-14 | — | — | US | claimed |
| WO-2025137551-A1 | AMINE PURIFICATION IN A CARBON CAPTURE METHOD USING MOF BODIES | SCHLUMBERGER TECHNOLOGY CORPORATION (US) | 2025-06-26 | — | — | WO | disclosed |
| CN-119387948-A | Cleaning-free low-residue soldering paste and preparation method thereof | 深圳市绿色千田锡业科技有限公司 | 2025-02-07 | — | — | CN | disclosed |
| EP-4359111-A1 | MBZA/PEG ETHYL ETHER BASED LIQUID SOLVENT CO2 CAPTURE IN ROTATING PACKED BED | Research Triangle Institute (US) | 2024-05-01 | — | — | EP | disclosed |
| US-5892125-A | REACTING 1,3-BUTADIENE WITH AN AMINE; ISOMERIZATION | BASF AKTIENGESELLSCHAFT (DE) | 1999-04-06 | — | — | US | disclosed |
| US-5705707-A | REACTING 1,3-BUTADIENE WITH ALCOHOL; ISOMERIZATION USING TRANSITION METAL CATALYST; HYDROGENATION, HYDROLYSIS | BASF AKTIENGESELLSCHAFT (DE) | 1998-01-06 | — | — | US | disclosed |
| US-4075830-A | Solid adhesive compositions | KONISHI CO., LTD. (JA) | 1978-02-28 | — | — | US | disclosed |
| US-4073756-A | WAX-LIKE OR JELLY-LIKE AT ROOM TEMPERATURE | KONISHI CO., LTD. (JA) | 1978-02-14 | — | — | US | disclosed |