SCHEMBL14660673

SCHEMBL14660673

CCO[Si](CC)(CC(C)CN)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL614128 0.77
SCHEMBL5833764 0.77
SCHEMBL2827743 0.76
SCHEMBL28785372 0.73
Ammonia Solution, Strong SCHEMBL3743233 0.72
SCHEMBL2552955 0.72
SCHEMBL2461562 0.72
SCHEMBL7527823 0.71
SCHEMBL2336176 0.71
SCHEMBL2802335 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110382649-A Reactive hot melt polyurethane adhesives with low monomeric diisocyanate content H.B.富乐公司 2019-10-25 CN disclosed
WO-2018165546-A1 REACTIVE HOT MELT POLYURETHANE ADHESIVE WITH LOW MONOMERIC DIISOCYANATE CONTENT H.B. FULLER COMPANY (US) 2018-09-13 WO disclosed
WO-2015065935-A1 USE OF MOLECULAR SIEVES TO EXPAND ONE-COMPONENT FOAMS UPON EXPOSURE TO MOISTURE ROYAL ADHESIVES AND SEALANTS, LLC (US) 2015-05-07 WO disclosed
WO-2013016130-A2 A REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS H.B. FULLER COMPANY (US) 2013-01-31 WO disclosed