SCHEMBL1470046

SCHEMBL1470046

CO[Si](OC)(OC)C(F)(F)CF

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8076073 0.74
SCHEMBL6051783 0.72
SCHEMBL8076067 0.72
SCHEMBL4380472 0.72
SCHEMBL20477585 0.70
SCHEMBL20496937 0.69
SCHEMBL6419730 0.69
SCHEMBL28453519 0.69
SCHEMBL374571 0.67
SCHEMBL28451364 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4195099-B1 DISCONNECTION DETECTION DEVICE TORAY INDUSTRIES (JP) 2025-08-13 EP disclosed
EP-3471133-B1 MEMORY ARRAY, METHOD FOR PRODUCING MEMORY ARRAY, MEMORY ARRAY SHEET, METHOD FOR PRODUCING MEMORY ARRAY SHEET, AND WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2025-08-06 EP disclosed
CN-115356873-B Resin composition, light-shielding film, method for producing light-shielding film, and substrate with barrier ribs 东丽株式会社 2025-04-25 CN disclosed
EP-3410468-B1 N-TYPE SEMICONDUCTOR ELEMENT, COMPLEMENTARY TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND WIRELESS COMMUNICATION DEVICE IN WHICH THE SAME IS USED TORAY INDUSTRIES (JP) 2024-07-10 EP disclosed
EP-3693290-B1 PACKING MATERIAL AND METHOD FOR PRODUCING PACKING MATERIAL TORAY INDUSTRIES (JP) 2024-01-17 EP disclosed
EP-3382751-B1 FERROELECTRIC MEMORY ELEMENT, METHOD FOR PRODUCING SAME, MEMORY CELL USING FERROELECTRIC MEMORY ELEMENT, AND RADIO COMMUNICATION DEVICE USING FERROELECTRIC MEMORY ELEMENT TORAY INDUSTRIES (JP) 2023-09-13 EP disclosed
EP-4195099-A1 DISCONNECTION DETECTION DEVICE Toray Industries, Inc. (JP) 2023-06-14 EP disclosed
CN-109716491-B Method for manufacturing field effect transistor and method for manufacturing wireless communication device 东丽株式会社 2023-06-09 CN disclosed
CN-111771163-B Negative photosensitive coloring composition, cured film, and touch panel using same 东丽株式会社 2023-06-02 CN disclosed
EP-3514822-B1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2023-04-26 EP disclosed
US-20180277619-A1 CAPACITOR, METHOD FOR MANUFACTURING SAME, AND WIRELESS COMMUNICATION DEVICE USING SAME TORAY INDUSTRIES, INC. (JP) 2018-09-27 US disclosed
US-20180264778-A1 LAMINATED BASE MATERIAL, COVER GLASS, TOUCH PANEL, AND METHOD FOR MANUFACTURING LAMINATED BASE MATERIAL TORAY INDUSTRIES, INC. (JP) 2018-09-20 US disclosed
EP-3367402-A1 CAPACITOR, METHOD FOR MANUFACTURING SAME, AND WIRELESS COMMUNICATION DEVICE USING SAME Toray Industries, Inc. (JP) 2018-08-29 EP disclosed
US-10040907-B2 Method for producing siloxane resin KANEKA CORPORATION (JP) 2018-08-07 US disclosed
EP-3208295-A1 METHOD FOR PRODUCING SILOXANE RESIN Kaneka Corporation (JP) 2017-08-23 EP disclosed
US-20170204226-A1 METHOD FOR PRODUCING SILOXANE RESIN KANEKA CORPORATION (JP) 2017-07-20 US disclosed
US-9580567-B2 Positive-type photosensitive siloxane composition AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2017-02-28 US disclosed
US-20150291749-A1 POSITIVE-TYPE PHOTOSENSITIVE SILOXANE COMPOSITION AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. 2015-10-15 US disclosed
US-9048445-B2 Gate insulating material, gate insulating film and organic field-effect transistor TORAY INDUSTRIES, INC. (JP) 2015-06-02 US disclosed
US-20110068417-A1 GATE INSULATING MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD-EFFECT TRANSISTOR TORAY INDUSTRIES, INC. (JP) 2011-03-24 US disclosed