SCHEMBL1470083

SCHEMBL1470083

O=N[Ir]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL168279 0.55
SCHEMBL809291 0.55
SCHEMBL3084255 0.50
SCHEMBL3784745 0.50
SCHEMBL11337194 0.50
SCHEMBL390702 0.50
SCHEMBL596902 0.50
SCHEMBL22807002 0.50
SCHEMBL6727427 0.50
SCHEMBL3859148 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117983212-A CO-SCR catalyst and preparation method and application thereof 中国环境科学研究院 2024-05-07 CN disclosed
EP-1922588-B1 PATTERN EXPOSURE METHOD AND PATTERN EXPOSURE APPARATUS FUJIFILM CORP (JP) 2015-01-07 EP disclosed
US-8383330-B2 Pattern exposure method and pattern exposure apparatus FUJIFILM CORPORATION (JP) 2013-02-26 US disclosed
US-8043800-B2 Photosensitive material for forming conductive film, and conductive material FUJIFILM CORPORATION (JP) 2011-10-25 US disclosed
US-20110070404-A1 PHOTOSENSITIVE MATERIAL FOR FORMING CONDUCTIVE FILM, AND CONDUCTIVE MATERIAL FUJIFILM CORPORATION (JP) 2011-03-24 US disclosed
US-7829270-B2 Photosensitive material, method of manufacturing conductive metal film, conductive metal film and light-transmitting film shielding electromagnetic wave for plasma display panel FUJIFILM CORPORATION (JP) 2010-11-09 US disclosed
US-20100078330-A1 APPARATUS AND METHOD FOR MANUFACTURING PLATED FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20090268186-A1 PATTERN EXPOSURE METHOD AND PATTERN EXPOSURE APPARATUS FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090017277-A1 comprising a support; and an emulsion layer containing a silver salt emulsion, the photosensitive material being capable of forming a conductive metal film by exposing and developing the emulsion layer, wherein the emulsion layer has a swelling rate of 150% or more FUJIFILM CORPORATION (JP) 2009-01-15 US disclosed
EP-1922588-A1 PATTERN EXPOSURE METHOD AND PATTERN EXPOSURE APPARATUS FUJIFILM Corporation (JP) 2008-05-21 EP disclosed
WO-2007029852-A1 PATTERN EXPOSURE METHOD AND PATTERN EXPOSURE APPARATUS FUJIFILM CORPORATION (JP) 2007-03-15 WO disclosed
WO-2006137555-A1 APPARATUS AND METHOD FOR MANUFACTURING PLATED FILM FUJIFILM CORPORATION (JP) 2006-12-28 WO disclosed
WO-2006126739-A1 PHOTOSENSITIVE MATERIAL, METHOD OF MANUFACTURING CONDUCTIVE METAL FILM, CONDUCTIVE METAL FILM AND LIGHT-TRANSMITTING FILM SHIELDING ELECTROMAGNETIC WAVE FOR PLASMA DISPLAY PANEL FUJIFILM CORPORATION (JP) 2006-11-30 WO disclosed
US-6521389-B2 Used in graphic arts; contrast FUJI PHOTO FILM CO., LTD. (JP) 2003-02-18 US disclosed
US-6472132-B1 Silver halide photographic light-sensitive material and processing method thereof FUJI PHOTO FILM CO., LTD. (JP) 2002-10-29 US disclosed
US-6468710-B1 HYDRAZINE NUCLEATING AGENT, PERFLUOROALKYL SURFACTANT FUJI PHOTO FILM CO., LTD. (JP) 2002-10-22 US disclosed
US-6458522-B1 QUATERNARY AMMONIUM OR PHOSPHORUS SALT; ULTRA-HIGH CONTRAST FUJI PHOTO FILM CO., LTD. (JP) 2002-10-01 US disclosed
US-20020132179-A1 Silver halide photographic light-sensitive material and processing method thereof FUJIFILM CORPORATION (JP) 2002-09-19 US disclosed
US-6171753-B1 SUPPORT HAVING THEREON SPECTRALLY SENSITIZED LIGHT SENSITIVE SILVER HALIDE EMULSION LAYER CONTAINING AT LEAST TWO KINDS OF SILVER HALIDE EMULSIONS DIFFERENT IN THE CONCENTRATION OF A NITROGEN HETEROCYCLE CAPABLE OF FORMING COMPLEX WITH SILVER FUJI PHOTO FILM CO., LTD. (JP) 2001-01-09 US disclosed
US-4612402-A Oxidation of olefins using rhodium nitro complex ALLIED CORPORATION (US) 1986-09-16 US disclosed