SCHEMBL1470753

SCHEMBL1470753

CC(C)O[Si](OC(C)C)(OC(C)C)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(C)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1470020 1.00
SCHEMBL1470715 0.82
SCHEMBL20979874 0.82
SCHEMBL1469993 0.82
SCHEMBL205691 0.82
SCHEMBL206746 0.82
SCHEMBL1322269 0.82
SCHEMBL4864205 0.82
SCHEMBL15453505 0.81
SCHEMBL16241608 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115356873-B Resin composition, light-shielding film, method for producing light-shielding film, and substrate with barrier ribs 东丽株式会社 2025-04-25 CN disclosed
WO-2025022873-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND FINGERPRINT AUTHENTICATION DEVICE USING SAID CURED FILM 東レ株式会社 2025-01-30 WO disclosed
US-20240384065-A1 SILOXANE RESIN COMPOSITION FOR FORMING CURED FILM, CURED FILM, AND METHOD OF PRODUCING POLYSILOXANE TORAY INDUSTRIES, INC. (JP) 2024-11-21 US disclosed
CN-113474730-B Negative photosensitive resin composition, method for producing cured film using same, and touch panel 东丽株式会社 2024-10-01 CN disclosed
EP-3410468-B1 N-TYPE SEMICONDUCTOR ELEMENT, COMPLEMENTARY TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND WIRELESS COMMUNICATION DEVICE IN WHICH THE SAME IS USED TORAY INDUSTRIES (JP) 2024-07-10 EP disclosed
CN-117859098-A Photosensitive resin composition and microlens 东丽株式会社 2024-04-09 CN disclosed
CN-111919173-B Positive photosensitive resin composition, cured film thereof, and solid-state imaging device provided with cured film 东丽株式会社 2024-04-02 CN disclosed
CN-115427514-B Resin composition, light-shielding film, and substrate with partition wall 东丽株式会社 2024-01-02 CN disclosed
CN-110573964-B Negative photosensitive resin composition and cured film 东丽株式会社 2023-11-03 CN disclosed
US-11789363-B2 Positive photosensitive resin composition, cured film therefrom, and solid state image sensor comprising the same TORAY INDUSTRIES, INC. (JP) 2023-10-17 US disclosed
EP-2360194-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING SAME Toray Industries, Inc. (JP) 2011-08-24 EP disclosed
US-20110068417-A1 GATE INSULATING MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD-EFFECT TRANSISTOR TORAY INDUSTRIES, INC. (JP) 2011-03-24 US disclosed
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-12-16 US disclosed
EP-2259289-A1 GATE INSULATING MATERIAL, GATE INSULATING FILM, AND ORGANIC FIELD EFFECT TRANSISTOR Toray Industries, Inc. (JP) 2010-12-08 EP disclosed
EP-2239301-A1 SILOXANE RESIN COMPOSITIONS Toray Industries, Inc. (JP) 2010-10-13 EP disclosed
US-20100196655-A1 DISPLAY-USE FILTER TORAY ADVANCED FILM CO., LTD. (JP) 2010-08-05 US disclosed
US-20090105360-A1 SILOXANE RESIN COMPOSITION AND PRODUCTION METHOD THEREOF TORAY INDUSTRIES, INC. (JP) 2009-04-23 US disclosed
EP-1942150-A1 SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2008-07-09 EP disclosed
US-20070266896-A1 Siloxane-Based Coating Material, Optical Article, and Production Method of Siloxane-Based Coating Material TORAY INDUSTRIES, INC. (JP) 2007-11-22 US disclosed
EP-1760126-A1 SILOXANE COATING MATERIAL, OPTICAL ARTICLES AND PROCESS FOR THE PRODUCTION OF SILOXANE COATING MATERIALS TORAY INDUSTRIES, INC. (JP) 2007-03-07 EP disclosed