SCHEMBL14734995

SCHEMBL14734995

CO[Si](OC)(OC)C1C=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1702932 0.87
SCHEMBL17973985 0.80
SCHEMBL27528210 0.63
SCHEMBL12749772 0.61
SCHEMBL1703943 0.60
SCHEMBL12368417 0.59
SCHEMBL8626315 0.59
SCHEMBL12368414 0.59
SCHEMBL1703084 0.58
SCHEMBL12368412 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4155361-B1 ADHESIVE COMPOSITION NIPPON SODA CO (JP) 2025-09-03 EP disclosed
US-12104092-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2024-10-01 US disclosed
US-20240002705-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2024-01-04 US disclosed
US-11795353-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-10-24 US disclosed
EP-4155361-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-03-29 EP disclosed
EP-3527642-B1 ADHESIVE COMPOSITION NIPPON SODA CO (JP) 2022-12-21 EP disclosed
CN-113956175-A Adhesive composition 日本曹达株式会社 2022-01-21 CN disclosed
US-20210284879-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2021-09-16 US disclosed
CN-108291108-B Coating agent 日本曹达株式会社 2020-12-18 CN disclosed
CN-107614554-B Organic-inorganic composite 日本曹达株式会社 2020-07-17 CN disclosed
CN-107112366-B Organic thin film transistor 日本曹达株式会社 2020-07-10 CN disclosed
WO-2019198792-A1 ADHESIVE COMPOSITION 日本曹達株式会社 2019-10-17 WO disclosed
EP-3527642-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2019-08-21 EP disclosed
EP-3395915-A1 COATING AGENT Nippon Soda Co., Ltd. (JP) 2018-10-31 EP disclosed
US-20180273793-A1 COATING AGENT NIPPON SODA CO., LTD. (JP) 2018-09-27 US disclosed
US-20180118953-A1 ORGANIC-INORGANIC HYBRID NIPPON SODA CO., LTD. (JP) 2018-05-03 US disclosed
EP-3315523-A1 ORGANIC-INORGANIC COMPOSITE Nippon Soda Co., Ltd. (JP) 2018-05-02 EP disclosed
US-9511514-B2 Process for production of replica mold for imprinting use NIPPON SODA CO., LTD. (JP) 2016-12-06 US disclosed
US-20130078333-A1 PROCESS FOR PRODUCTION OF REPLICA MOLD FOR IMPRINTING USE NIPPON SODA CO., LTD. (JP) 2013-03-28 US disclosed
EP-2565014-A1 PROCESS FOR PRODUCTION OF REPLICA MOLD FOR IMPRINTING USE Nippon Soda Co., Ltd. (JP) 2013-03-06 EP disclosed