SCHEMBL14735684

SCHEMBL14735684

Cc1ccc(/C(c2cccc(Cl)c2)=[Zr](\C2=CC=CC2)c2c(C(C)(C)C)ccc3c2Cc2cc(C(C)(C)C)ccc2-3)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20721349 0.95 HSP90AA1 (0.31)
SCHEMBL21407003 0.94 HSP90AA1 (0.32)
Hydrochloric Acid SCHEMBL18142135 0.94 HSP90AA1 (0.31)
SCHEMBL2869216 0.91
Hydrochloric Acid SCHEMBL18280807 0.91
SCHEMBL21406907 0.89 HSP90AA1 (0.31)
SCHEMBL6225206 0.89 KCNK3 (0.31)
SCHEMBL20721376 0.89 POLB (0.30)
Hydrochloric Acid SCHEMBL18280848 0.88 KCNK3 (0.30)
Hydrochloric Acid SCHEMBL18280830 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2080784-B1 PROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING PROPYLENE RESIN COMPOSITION, PROPYLENE POLYMER COMPOSITION, MOLDED BODY MADE OF THE PROPYLENE RESIN COMPOSITION, AND ELECTRIC WIRE MITSUI CHEMICALS INC (JP) 2013-03-06 EP disclosed