⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5705227 | 1.00 | — | — | |
| SCHEMBL3933921 | 1.00 | — | — | |
| SCHEMBL3933912 | 1.00 | — | — | |
| SCHEMBL12544506 | 0.89 | — | — | |
| SCHEMBL3945813 | 0.88 | — | — | |
| SCHEMBL3943541 | 0.88 | — | — | |
| SCHEMBL11797442 | 0.88 | — | — | |
| SCHEMBL3945820 | 0.88 | — | — | |
| SCHEMBL3943548 | 0.88 | — | — | |
| SCHEMBL6258921 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3847032-B1 | HYBRID WET ON WET PRINTING METHODS | KAO CORP (JP) | 2025-12-03 | — | — | EP | disclosed |
| US-11807022-B2 | Hybrid wet on wet printing methods | KAO CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| EP-3601452-B1 | RADIATION CURABLE INK COMPOSITIONS, PRINTED ARTICLES, AND METHODS OF USING THE SAME | KAO CORP (JP) | 2023-09-13 | — | — | EP | disclosed |
| EP-3775064-B1 | IN-LINE PRIMER PRINTING METHODS | KAO CORP (JP) | 2023-09-13 | — | — | EP | disclosed |
| EP-3572879-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-04-19 | — | — | EP | disclosed |
| US-20230075719-A1 | AQUEOUS ENERGY CURABLE INKJET INKS | KAO CORPORATION (JP) | 2023-03-09 | — | — | US | disclosed |
| CN-112672887-B | Hybrid wet-on-wet printing process | 花王株式会社 | 2023-02-28 | — | — | CN | disclosed |
| EP-4087902-A1 | AQUEOUS ENERGY CURABLE INKJET INKS | Kao Corporation (JP) | 2022-11-16 | — | — | EP | disclosed |
| US-11479684-B2 | Radiation curable inkjet ink compositions, printed articles, and thermal inkjet methods of using the same | KAO CORPORATION (JP) | 2022-10-25 | — | — | US | disclosed |
| CN-114929812-A | Aqueous energy curable inkjet inks | 花王株式会社 | 2022-08-19 | — | — | CN | disclosed |
| EP-2813889-A2 | Photoresist underlayer film-forming composition and pattern forming process | Shin-Etsu Chemical Co., Ltd. (JP) | 2014-12-17 | — | — | EP | disclosed |
| EP-2813892-A2 | Photoresist underlayer film-forming composition and pattern forming process | Shin-Etsu Chemical Co., Ltd. (JP) | 2014-12-17 | — | — | EP | disclosed |
| US-20140363958-A1 | UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-12-11 | — | — | US | disclosed |
| US-20140363956-A1 | UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-12-11 | — | — | US | disclosed |
| US-20140363957-A1 | UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-12-11 | — | — | US | disclosed |
| US-20140363955-A1 | UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-12-11 | — | — | US | disclosed |
| US-7915524-B2 | Sealing agent for photoelectric conversion device and photoelectric conversion device using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2011-03-29 | — | — | US | disclosed |
| US-20060162771-A1 | Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-07-27 | — | — | US | disclosed |
| EP-1598897-A1 | SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-6210790-B1 | TRANSPARENCY, HARDNESS, ABRASION-RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE | 2001-04-03 | — | — | US | disclosed |