SCHEMBL14764609

SCHEMBL14764609

B[N+]1(C)CCOCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL511927 0.74
Iodide SCHEMBL10532969 0.71
SCHEMBL14470535 0.71 TTR (0.43)
Bromide SCHEMBL9398217 0.71
SCHEMBL9177113 0.71 TTR (0.33)
Hydrochloric Acid SCHEMBL1934796 0.71
Water SCHEMBL1826623 0.71
Fluoride Ion SCHEMBL11098780 0.71
SCHEMBL12005489 0.69
SCHEMBL7424166 0.69 TTR (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10077498-B2 Method for depositing a copper seed layer onto a barrier layer and copper plating bath ATOTECH DEUTSCHLAND GMBH (DE) 2018-09-18 US claimed
EP-3049550-B1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-23 EP claimed
EP-3049550-A1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH Deutschland GmbH (DE) 2016-08-03 EP claimed
US-20160194760-A1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH USA, LLC 2016-07-07 US claimed
WO-2013034676-A1 PROCESS FOR THE SYNTHESIS OF TELAVANCIN, ITS PHARMACEUTICALLY ACCEPTABLE SALTS AS WELL AS AN N-PROTECTED IMINE-DERIVATIVE OF TELAVANCIN SANDOZ AG (CH) 2013-03-14 WO claimed
WO-2013034675-A1 PROCESS FOR THE SYNTHESIS OF TELAVANCIN AND ITS PHARMACEUTICALLY ACCEPTABLE SALTS AS WELL AS N-PROTECTED DERIVATIVES THEREOF SANDOZ AG (CH) 2013-03-14 WO claimed
US-20190024239-A1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH DEUTSCHLAND GMBH (DE) 2019-01-24 US disclosed
US-10077498-B2 Method for depositing a copper seed layer onto a barrier layer and copper plating bath ATOTECH DEUTSCHLAND GMBH (DE) 2018-09-18 US disclosed
EP-3049550-B1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-23 EP disclosed
US-20160194760-A1 METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH ATOTECH USA, LLC 2016-07-07 US disclosed
WO-2013034676-A1 PROCESS FOR THE SYNTHESIS OF TELAVANCIN, ITS PHARMACEUTICALLY ACCEPTABLE SALTS AS WELL AS AN N-PROTECTED IMINE-DERIVATIVE OF TELAVANCIN SANDOZ AG (CH) 2013-03-14 WO disclosed
WO-2013034675-A1 PROCESS FOR THE SYNTHESIS OF TELAVANCIN AND ITS PHARMACEUTICALLY ACCEPTABLE SALTS AS WELL AS N-PROTECTED DERIVATIVES THEREOF SANDOZ AG (CH) 2013-03-14 WO disclosed