Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2801493 | 0.90 | KDM4E (0.40) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063128 | 0.84 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063813 | 0.80 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063396 | 0.78 | KDM4E (0.35) | KDM4EALDH1A1 | |
| SCHEMBL6062699 | 0.78 | KDM4E (0.35) | KDM4EALDH1A1 | |
| SCHEMBL6064090 | 0.78 | KDM4E (0.35) | KDM4EALDH1A1 | |
| SCHEMBL7539017 | 0.78 | KDM4E (0.39) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL19689468 | 0.78 | KDM4E (0.46) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL1975023 | 0.78 | KDM4E (0.46) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL4787578 | 0.77 | KDM4E (0.41) | KDM4EALDH1A1MEN1KMT2AHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-7808083-B2 | Semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100120937-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| CN-101679721-A | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE CO | 2010-03-24 | — | — | CN | disclosed |
| EP-2161744-A1 | ELECTRONIC DEVICE MANUFACTURING METHOD | Sumitomo Bakelite Co., Ltd. (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-20090008682-A1 | Light-Receiving Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| US-20080277805-A1 | Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-11-13 | — | — | US | disclosed |
| EP-1804296-B1 | LIGHT-RECEIVING DEVICE | SUMITOMO BAKELITE CO (JP) | 2008-10-01 | — | — | EP | disclosed |
| US-20080090176-A1 | Semiconductor Wafer And Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-04-17 | — | — | US | disclosed |
| EP-1804296-A1 | LIGHT-RECEIVING DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1804291-A1 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1801872-A1 | SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-06-27 | — | — | EP | disclosed |