SCHEMBL14780313

SCHEMBL14780313

Cc1ccc(S(=O)(=O)OC2CC(OS(=O)(=O)c3ccc(C)cc3)CC(OS(=O)(=O)c3ccc(C)cc3)C2)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 2/20 0.58
CYP1A2 P05177 1/20 0.51
GAA P10253 2/20 0.46
CYP3A4 P08684 3/20 0.46
CYP2C19 P33261 2/20 0.46
NAAA Q02083 1/20 0.44
SMN1; SMN2 Q16637 3/20 0.44
KMT2A Q03164 2/20 0.44
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
CA12 O43570 1/20 0.43
CA3 P07451 1/20 0.43
CA6 P23280 1/20 0.43
CA5A P35218 1/20 0.43
CA7 P43166 1/20 0.43
CA9 Q16790 1/20 0.43
CA5B Q9Y2D0 1/20 0.43
VDR P11473 1/20 0.42
TLR9 Q9NR96 1/20 0.42
LMNA P02545 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11024375 1.00 CYP2D6 (0.58) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL11024377 1.00 CYP2D6 (0.58) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL31680818 0.93 CYP2D6 (0.52) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL30865542 0.93 CYP2D6 (0.52) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL16712223 0.93 CYP2D6 (0.52) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL25417201 0.93 CYP2D6 (0.52) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL7397961 0.93 CYP2D6 (0.52) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL14778959 0.92 CYP2D6 (0.59) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL16712215 0.91 CYP2D6 (0.55) CYP2D6CYP1A2GAACYP3A4CYP2C19
SCHEMBL14779139 0.91 CYP2D6 (0.55) CYP2D6CYP1A2GAACYP3A4CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1847568-B1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM SUMITOMO BAKELITE CO (JP) 2015-05-20 EP claimed
US-9240614-B2 Nonaqueous electrolyte solution and electrochemical element using same UBE INDUSTRIES, LTD. (JP) 2016-01-19 US disclosed
EP-1847568-B1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING-RESIN MOLDING MATERIAL, AND CURED OBJECT OBTAINED THEREFROM SUMITOMO BAKELITE CO (JP) 2015-05-20 EP disclosed
EP-2579377-B1 NONAQUEOUS ELECTROLYTE SOLUTION AND ELECTROCHEMICAL ELEMENT USING SAME UBE INDUSTRIES (JP) 2014-09-03 EP disclosed
EP-2579377-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND ELECTROCHEMICAL ELEMENT USING SAME Ube Industries, Ltd. (JP) 2013-04-10 EP disclosed
US-20130071733-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND ELECTROCHEMICAL ELEMENT USING SAME UBE INDUSTRIES, LTD. (JP) 2013-03-21 US disclosed