Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP8 | Q6V1X1 | 2/20 | 0.33 |
| ▸ | DPP9 | Q86TI2 | 2/20 | 0.33 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.33 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.33 |
| ▸ | DPP4 | P27487 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14997662 | 0.88 | DPP8 (0.32) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL14183864 | 0.88 | CYP17A1 (0.34) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL16866393 | 0.87 | DPP8 (0.34) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL19360782 | 0.87 | DPP8 (0.32) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL10040425 | 0.86 | CYP19A1 (0.36) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL13046103 | 0.86 | DPP8 (0.36) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL15905714 | 0.86 | CYP17A1 (0.35) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL14466004 | 0.86 | EPHX2 (0.33) | DPP8DPP9CYP17A1CYP19A1 | |
| SCHEMBL13563630 | 0.85 | DPP8 (0.33) | DPP8DPP9CYP17A1CYP19A1DPP4 | |
| SCHEMBL14330864 | 0.85 | DPP8 (0.33) | DPP8DPP9CYP17A1CYP19A1DPP4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9423689-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device and electronic device | FUJIFILM CORPORATION (JP) | 2016-08-23 | — | — | US | disclosed |
| US-20160147156-A1 | PATTERN FORMATION METHOD, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-05-26 | — | — | US | disclosed |
| US-9244344-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2016-01-26 | — | — | US | disclosed |
| US-9140981-B2 | Actinic-ray-sensitive or radiation-sensitive resin composition, and resist film using the same, pattern forming method, electronic device manufacturing method, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2015-09-22 | — | — | US | disclosed |
| US-9120288-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for preparing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2015-09-01 | — | — | US | disclosed |
| US-20150093692-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM USED THEREFOR, AND ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE USING THE SAMEDEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2015-04-02 | — | — | US | disclosed |
| US-8790860-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, and resist film, pattern forming method, method for preparing electronic device, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| US-20140141360-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-05-22 | — | — | US | disclosed |
| US-20130078434-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND, RESIST FILM, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130078432-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR PREPARING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130078426-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM, PATTERN FORMING METHOD, METHOD FOR PREPARING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130078433-A1 | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM USING THE SAME, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |