Methane

Methane

SCHEMBL14815554

C.P.[SiH4]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methane SCHEMBL17670000 0.87
Methane SCHEMBL29265610 0.87
Methane SCHEMBL27849793 0.87
Methane SCHEMBL28299638 0.87
Methane SCHEMBL28167325 0.87
Methane SCHEMBL28299415 0.87
Methane SCHEMBL27707596 0.87
Methane SCHEMBL1856821 0.82
Methane SCHEMBL402611 0.82
Phosphine SCHEMBL10628146 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 139 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120057924-A Preparation method of high-capacity silicon-carbon anode material 南通睿理新能源科技有限公司 2025-05-30 CN claimed
CN-110729189-B Semiconductor device and method for manufacturing the same 中芯国际集成电路制造(天津)有限公司 2023-06-30 CN claimed
CN-110854200-B N-type semiconductor device and method for manufacturing the same 上海华力集成电路制造有限公司 2023-04-07 CN claimed
US-20220199804-A1 Integrated CMOS Source Drain Formation With Advanced Control APPLIED MATERIALS, INC. (US) 2022-06-23 US claimed
US-11309404-B2 Integrated CMOS source drain formation with advanced control APPLIED MATERIALS, INC. (US) 2022-04-19 US claimed
CN-109755297-B Semiconductor device and method for manufacturing the same 中芯国际集成电路制造(上海)有限公司 2021-09-03 CN claimed
US-10998425-B2 FinFET structure and method for fabricating the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-05-04 US claimed
CN-110854200-A N-type semiconductor device and method of manufacturing the same 上海华力集成电路制造有限公司 2020-02-28 CN claimed
CN-110729189-A Semiconductor device and method for manufacturing the same 中芯国际集成电路制造(天津)有限公司 2020-01-24 CN claimed
CN-104241360-B Semiconductor device and method for fabricating the same 联华电子股份有限公司 2019-07-23 CN claimed
US-20180040720-A1 FINFET Structure and Method for Fabricating the Same TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2018-02-08 US claimed
US-9853129-B2 Forming non-line-of-sight source drain extension in an nMOS finFET using n-doped selective epitaxial growth APPLIED MATERIALS, INC. (US) 2017-12-26 US claimed
US-20170330960-A1 FORMING NON-LINE-OF-SIGHT SOURCE DRAIN EXTENSION IN AN NMOS FINFET USING N-DOPED SELECTIVE EPITAXIAL GROWTH APPLIED MATERIALS, INC. 2017-11-16 US claimed
US-9536985-B2 Epitaxial growth of material on source/drain regions of FinFET structure GLOBALFOUNDRIES INC. (KY) 2017-01-03 US claimed
US-9520498-B2 FinFET structure and method for fabricating the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-12-13 US claimed
US-9425310-B2 Methods for forming wrap around contact TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2016-08-23 US claimed
US-20160093720-A1 EPITAXIAL GROWTH OF MATERIAL ON SOURCE/DRAIN REGIONS OF FINFET STRUCTURE GLOBALFOUNDRIES U.S. INC. 2016-03-31 US claimed
US-20150263159-A1 FINFET Structure and Method for Fabricating the Same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2015-09-17 US claimed
US-20150255604-A1 WRAP AROUND CONTACT TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2015-09-10 US claimed
CN-104241360-A Semiconductor device and method for fabricating the same UNITED MICROELECTRONICS CORP 2014-12-24 CN claimed