Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 2/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.51 |
| ▸ | TP53 | P04637 | 1/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
| ▸ | CARM1 | Q86X55 | 1/20 | 0.38 |
| ▸ | SLC6A4 | P31645 | 4/20 | 0.38 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.38 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.38 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.37 |
| ▸ | HTR2A | P28223 | 2/20 | 0.37 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.37 |
| ▸ | DPP4 | P27487 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2201298 | 0.84 | SLC6A4 (0.50) | ALDH1A1GAATSHRPOLBSLC6A4 | |
| SCHEMBL1483859 | 0.83 | NCOA1 (0.51) | MAOBCYP3A4ALDH1A1GAATSHR | |
| Ammonia Solution, Strong SCHEMBL7130183 | 0.82 | SLC6A4 (0.49) | ALDH1A1GAATSHRPOLBSLC6A4 | |
| SCHEMBL10874836 | 0.80 | MAOB (0.51) | MAOBCYP3A4TP53ALDH1A1GAA | |
| SCHEMBL694250 | 0.80 | SLC6A4 (0.44) | MAOBCYP3A4ALDH1A1GAASLC6A4 | |
| SCHEMBL7917775 | 0.78 | MAOB (0.80) | MAOBCYP3A4TP53ALDH1A1GAA | |
| SCHEMBL707810 | 0.78 | MAOB (0.72) | MAOBCYP3A4TP53ALDH1A1GAA | |
| SCHEMBL29929290 | 0.78 | MAOB (0.72) | MAOBCYP3A4TP53ALDH1A1GAA | |
| SCHEMBL1683783 | 0.78 | MAOB (0.53) | MAOBCYP3A4TP53ALDH1A1GAA | |
| SCHEMBL28362166 | 0.76 | MAOB (0.59) | MAOBCYP3A4TP53ALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117903461-A | Preparation method of high-bulk-density soluble polyimide resin powder | 烟台九诚新材料有限公司 | 2024-04-19 | — | — | CN | claimed |
| WO-2025063274-A1 | POLYIMIDE RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2025-03-27 | — | — | WO | disclosed |
| WO-2024202774-A1 | POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2024-10-03 | — | — | WO | disclosed |
| CN-117903461-A | Preparation method of high-bulk-density soluble polyimide resin powder | 烟台九诚新材料有限公司 | 2024-04-19 | — | — | CN | disclosed |
| US-8304149-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2012-11-06 | — | — | US | disclosed |
| US-20110076458-A1 | PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTERNS, AND ELECTRONIC EQUIPMENT | NUNOMURA MASATAKA | 2011-03-31 | — | — | US | disclosed |
| US-7851128-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| EP-1376231-B1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEM DUPONT MICROSYS (JP) | 2009-04-01 | — | — | EP | disclosed |
| US-20070072122-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | NUNOMURA MASATAKA | 2007-03-29 | — | — | US | disclosed |
| US-7150947-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2006-12-19 | — | — | US | disclosed |
| EP-0786928-B1 | Novel flexible copper-coated laminate and flexible printed circuit board | KANEGAFUCHI CHEMICAL IND (JP) | 2006-01-11 | — | — | EP | disclosed |
| US-20040029045-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2004-02-12 | — | — | US | disclosed |
| EP-1376231-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2004-01-02 | — | — | EP | disclosed |
| EP-0786928-A1 | Novel flexible copper-coated laminate and flexible printed circuit board | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1997-07-30 | — | — | EP | disclosed |
| US-5637382-A | Flexible copper-coated laminate and flexible printed circuit board | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1997-06-10 | — | — | US | disclosed |