SCHEMBL1485733

SCHEMBL1485733

CO[SiH](CCC12CCCCC1O2)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1129683 0.84
SCHEMBL31252738 0.78
SCHEMBL6906954 0.75 CYP1A2 (0.33)
SCHEMBL9226162 0.75
SCHEMBL9488078 0.74
SCHEMBL7051116 0.73
SCHEMBL1023347 0.73
SCHEMBL9775468 0.71
SCHEMBL15106525 0.71
SCHEMBL1529261 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 530 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3484900-B1 FORMULATION CONTAINING A METAL APROTIC ORGANOSILANOXIDE COMPOUND DOW CORNING (US) 2020-07-01 EP claimed
EP-2718106-B1 INK JET PRINT HEAD COMPRISING A LAYER MADE BY A CURABLE RESIN COMPOSITION SICPA HOLDING SA (CH) 2020-07-01 EP claimed
WO-2014018814-A1 SELF-ADHERING CURABLE SILICONE ADHESIVE COMPOSITIONS AND PROCESS FOR MAKING THEREOF DOW CORNING CORPORATION (US) 2014-01-30 WO claimed
US-20090252923-A1 INK JET CARTRIDGE COMPRISING A LAYER MADE BY A CURABLE RESIN COMPOSITION TELECOM ITALIA S.P.A. (IT) 2009-10-08 US claimed
US-20090102089-A1 Epoxy Formulations for Use in Lithography Techniques DOW CORNING CORPORATION 2009-04-23 US claimed
EP-1976900-A1 EPOXY FORMULATIONS FOR USE IN LITHOGRAPHY TECHNIQUES Dow Corning Corporation (US) 2008-10-08 EP claimed
WO-2007087399-A1 EPOXY FORMULATIONS FOR USE IN LITHOGRAPHY TECHNIQUES DOW CORNING CORPORATION (US) 2007-08-02 WO claimed
EP-1664198-B1 SILICONES HAVING IMPROVED CHEMICAL RESISTANCE AND CURABLE SILICONE COMPOSITIONS HAVING IMPROVED MIGRATION RESISTANCE DOW CORNING (US) 2007-06-13 EP claimed
JP-2007502344-A 2007-02-08 JP claimed
EP-1664198-A1 SILICONES HAVING IMPROVED CHEMICAL RESISTANCE AND CURABLE SILICONE COMPOSITIONS HAVING IMPROVED MIGRATION RESISTANCE Dow Corning Corporation (US) 2006-06-07 EP claimed
US-7045586-B2 Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives DOW CORNING CORPORATION (US) 2006-05-16 US claimed
WO-2005019342-A1 SILICONES HAVING IMPROVED CHEMICAL RESISTANCE AND CURABLE SILICONE COMPOSITIONS HAVING IMPROVED MIGRATION RESISTANCE DOW CORNING CORPORATION (US) 2005-03-03 WO claimed
US-20050038217-A1 Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives DOW SILICONES CORPORATION 2005-02-17 US claimed
US-20050038188-A1 Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance DOW CORNING CORPORATION 2005-02-17 US claimed
US-12624264-B2 Solventless pressure sensitive adhesive composition DOW SILICONES CORPORATION (US) 2026-05-12 US disclosed
US-12624168-B2 Methods for making polyfunctional organosiloxanes and compositions containing same DOW SILICONES CORPORATION (US) 2026-05-12 US disclosed
US-12583876-B2 Branched organosilicon compound, method of preparing same, and related compositions DOW SILICONES CORPORATION (US) 2026-03-24 US disclosed
US-20050038217-A1 Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives DOW SILICONES CORPORATION 2005-02-17 US disclosed
US-20050038183-A1 Silicones having improved surface properties and curable silicone compositions for preparing the silicones DOW CORNING CORPORATION 2005-02-17 US disclosed
WO-2005001573-A2 ADHESION METHOD USING GRAY-SCALE PHOTOLITHOGRAPHY DOW CORNING CORPORATION (US) 2005-01-06 WO disclosed