SCHEMBL1485789

SCHEMBL1485789

CCCCCCC1(N)CCCCC1

nearest known ligand 0.37

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.36
THRB P10828 1/20 0.36
DNM1 Q05193 7/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
ALDH1A1 P00352 1/20 0.35
EPHX1 P07099 1/20 0.35
SIRT2 Q8IXJ6 1/20 0.34
CETP P11597 2/20 0.34
CNR1 P21554 1/20 0.34
CNR2 P34972 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15375296 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL6061239 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL15375292 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL3673746 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL6063488 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL1485626 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL10685233 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL6062501 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL6061746 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL6061592 1.00 TSHR (0.36) TSHRTHRBDNM1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2662378-B1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORP (JP) 2018-10-10 EP disclosed
US-9487726-B2 Imide compound, method for producing same, thickening agent for grease, and grease composition JX NIPPON OIL & ENERGY CORPORATION (JP) 2016-11-08 US disclosed
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-20130345102-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORPORATION (JP) 2013-12-26 US disclosed
EP-2662378-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX Nippon Oil & Energy Corporation (JP) 2013-11-13 EP disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
CN-102967995-A Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate FUJIFILM CORP 2013-03-13 CN disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
EP-1454958-B1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEM CO LTD (JP) 2006-10-04 EP disclosed
US-20050001349-A1 Lactic acid polymer composition and molded object thereof NEW JAPAN CHEMICAL CO., LTD. (JP) 2005-01-06 US disclosed
EP-1454958-A1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEMICAL CO.,LTD. (JP) 2004-09-08 EP disclosed
US-5973076-A MOLDING; CONTROLLING TEMPERATURE IN PRESENCE OF AN AMIDE COMPOUND NEW JAPAN CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed
EP-0776933-B1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEM CO LTD (JP) 1999-08-04 EP disclosed
EP-0776933-A1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1997-06-04 EP disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed