SCHEMBL14865653

SCHEMBL14865653

O=C1CC(=O)C2C3CC(C12)C1C(=O)OC(=O)C31

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.39
GMNN O75496 1/20 0.39
PPM1B O75688 1/20 0.39
LMNA P02545 1/20 0.39
PPP1CC P36873 1/20 0.39
TFPI2 P48307 1/20 0.39
RAB9A P51151 1/20 0.39
PPP5C P53041 1/20 0.39
PPP1CA P62136 1/20 0.39
PMP22 Q01453 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
TP53 P04637 1/20 0.39
CYP2D6 P10635 1/20 0.39
NFKB1 P19838 1/20 0.39
THPO P40225 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18179368 0.91 KDM4E (0.37) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL721779 0.87 KDM4E (0.48) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL19287328 0.87 KDM4E (0.48) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL15033322 0.86 KDM4E (0.44) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL24076788 0.81 KDM4E (0.33) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL18788380 0.81 KDM4E (0.33) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL6746009 0.79 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL13483328 0.79 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL13483332 0.79 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL3190490 0.79 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11782344-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2023-10-10 US disclosed
US-10036952-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-07-31 US disclosed
US-20170130006-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-11 US disclosed
US-20170117524-A1 SEPARATOR AND ELECTRODE ASSEMBLY OF LITHIUM SECONDARY BATTERY INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2017-04-27 US disclosed
US-20160313642-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 US disclosed
US-20160313641-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 US disclosed
US-9331280-B2 Transparent electrochromic polyimide, method for manufacturing the same, and electrochromic device utilizing the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2016-05-03 US disclosed
US-20140146380-A1 TRANSPARENT ELECTROCHROMIC POLYIMIDE, METHOD FOR MANUFACTURING THE SAME, AND ELECTROCHROMIC DEVICE UTILIZING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2014-05-29 US disclosed
US-8673540-B2 Photosensitive polymides ETERNAL CHEMICAL CO., LTD. (TW) 2014-03-18 US disclosed
US-20130286338-A1 Liquid Crystal Display Device and Method of Fabricating the Same LG DISPLAY CO LTD (KR) 2013-10-31 US disclosed
US-20130095426-A1 PHOTOSENSITIVE POLYMIDES ETERNAL CHEMICAL CO., LTD. (TW) 2013-04-18 US disclosed