⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24593004 | 0.86 | — | — | |
| SCHEMBL16846798 | 0.69 | — | — | |
| SCHEMBL6407765 | 0.69 | — | — | |
| SCHEMBL2989431 | 0.64 | — | — | |
| SCHEMBL11722180 | 0.64 | — | — | |
| SCHEMBL22001064 | 0.64 | — | — | |
| SCHEMBL12327733 | 0.62 | — | — | |
| SCHEMBL12327418 | 0.62 | — | — | |
| SCHEMBL18566518 | 0.62 | — | — | |
| SCHEMBL9845674 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10651286-B2 | High selectivity nitride removal process based on selective polymer deposition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-05-12 | — | — | US | disclosed |
| US-20190305109-A1 | HIGH SELECTIVITY NITRIDE REMOVAL PROCESS BASED ON SELECTIVE POLYMER DEPOSITION | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2019-10-03 | — | — | US | disclosed |
| US-10325998-B2 | High selectivity nitride removal process based on selective polymer deposition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2019-06-18 | — | — | US | disclosed |
| US-10269924-B2 | High selectivity nitride removal process based on selective polymer deposition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2019-04-23 | — | — | US | disclosed |
| US-20170194497-A1 | HIGH SELECTIVITY NITRIDE REMOVAL PROCESS BASED ON SELECTIVE POLYMER DEPOSITION | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-07-06 | — | — | US | disclosed |
| US-20170194457-A1 | HIGH SELECTIVITY NITRIDE REMOVAL PROCESS BASED ON SELECTIVE POLYMER DEPOSITION | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-07-06 | — | — | US | disclosed |
| US-9633948-B2 | Low energy etch process for nitrogen-containing dielectric layer | GLOBALFOUNDRIES INC. (KY) | 2017-04-25 | — | — | US | disclosed |
| US-9627533-B2 | High selectivity nitride removal process based on selective polymer deposition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-04-18 | — | — | US | disclosed |
| US-20160233335-A1 | HIGH SELECTIVITY NITRIDE REMOVAL PROCESS BASED ON SELECTIVE POLYMER DEPOSITION | ZEON CORPORATION (JP) | 2016-08-11 | — | — | US | disclosed |
| US-20160111374-A1 | LOW ENERGY ETCH PROCESS FOR NITROGEN-CONTAINING DIELECTRIC LAYER | GLOBALFOUNDRIES U.S. INC. | 2016-04-21 | — | — | US | disclosed |
| CN-103946954-A | High fidelity patterning employing a fluorohydrocarbon-containing polymer | IBM | 2014-07-23 | — | — | CN | disclosed |
| CN-103946975-A | Low energy etch process for nitrogen-containing dielectric layer | IBM | 2014-07-23 | — | — | CN | disclosed |
| US-8765613-B2 | High selectivity nitride etch process | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-07-01 | — | — | US | disclosed |
| CN-103890918-A | High selectivity nitride etch process | IBM | 2014-06-25 | — | — | CN | disclosed |
| WO-2013063179-A1 | LOW ENERGY ETCH PROCESS FOR NITROGEN-CONTAINING DIELECTRIC LAYER | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-05-02 | — | — | WO | disclosed |
| WO-2013062985-A1 | HIGH FIDELITY PATTERNING EMPLOYING A FLUOROHYDROCARBON-CONTAINING POLYMER | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-05-02 | — | — | WO | disclosed |
| US-20130108833-A1 | HIGH FIDELITY PATTERNING EMPLOYING A FLUOROHYDROCARBON-CONTAINING POLYMER | ZEON CORPORATION (JP) | 2013-05-02 | — | — | US | disclosed |
| US-20130105916-A1 | HIGH SELECTIVITY NITRIDE ETCH PROCESS | ZEON CORPORATION (JP) | 2013-05-02 | — | — | US | disclosed |
| WO-2013063182-A1 | HIGH SELECTIVITY NITRIDE ETCH PROCESS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-05-02 | — | — | WO | disclosed |
| US-20130105996-A1 | LOW ENERGY ETCH PROCESS FOR NITROGEN-CONTAINING DIELECTRIC LAYER | ZEON CORPORATION (JP) | 2013-05-02 | — | — | US | disclosed |