⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15358714 | 0.81 | — | — | |
| SCHEMBL991108 | 0.72 | — | — | |
| SCHEMBL3941743 | 0.69 | — | — | |
| SCHEMBL17066436 | 0.68 | — | — | |
| SCHEMBL17523623 | 0.67 | — | — | |
| SCHEMBL630936 | 0.67 | — | — | |
| SCHEMBL630935 | 0.67 | — | — | |
| SCHEMBL4650538 | 0.67 | — | — | |
| SCHEMBL16891345 | 0.67 | — | — | |
| SCHEMBL9053550 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2017049383-A1 | LIBRARIES OF HETEROARYL-CONTAINING MACROCYCLIC COMPOUNDS AND METHODS OF MAKING AND USING THE SAME | CYCLENIUM PHARMA INC. (CA) | 2017-03-30 | — | — | WO | disclosed |
| US-9545649-B2 | Method for safely and quickly shutting down and cleaning a hydroprocessing reactor of spent catalyst via a water flooding technique | CHEVRON U.S.A. INC. (US) | 2017-01-17 | — | — | US | disclosed |
| US-20160363603-A1 | SYSTEMS, DEVICES, MEDIA, AND METHODS FOR MEASURING ANALYTES IN BIOLOGICAL FLUIDS | SENTEC PTE LTD (SG) | 2016-12-15 | — | — | US | disclosed |
| US-20160346815-A1 | METHOD FOR SAFELY AND QUICKLY SHUTTING DOWN AND CLEANING A HYDROPROCESSING REACTOR OF SPENT CATALYST VIA A WATER FLOODING TECHNIQUE | CHEVRON U.S.A. INC. | 2016-12-01 | — | — | US | disclosed |
| US-9496195-B2 | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | STATS ChipPAC Pte. Ltd. (SG) | 2016-11-15 | — | — | US | disclosed |
| US-9490160-B2 | Method of manufacturing semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2016-11-08 | — | — | US | disclosed |
| US-20160276237-A1 | Semiconductor Device and Method to Minimize Stress on Stack Via | STATS ChipPAC Pte. Ltd. (SG) | 2016-09-22 | — | — | US | disclosed |
| US-20160238313-A1 | SYSTEM AND METHOD FOR RECOVERING NGL | BFX FABRICATION, LLC | 2016-08-18 | — | — | US | disclosed |
| US-9380129-B2 | Data redirection system and method therefor | CIRCADENCE CORPORATION (US) | 2016-06-28 | — | — | US | disclosed |
| EP-2650681-B1 | Radiopharmaceutical production system and quality control system utilizing high performance liquid chromatography | ABT MOLECULAR IMAGING INC (US) | 2015-12-30 | — | — | EP | disclosed |
| US-20140248756-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2014-09-04 | — | — | US | disclosed |
| US-20140246779-A1 | Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief | STATS CHIPPAC, LTD. (SG) | 2014-09-04 | — | — | US | disclosed |
| US-20140219691-A1 | METHOD OF TRANSFERRING IMAGE AND IMAGE TRANSFERRING SYSTEM AND IMAGE FORMING APPARATUS WITH SAME | RICOH COMPANY, LTD. (JP) | 2014-08-07 | — | — | US | disclosed |
| US-8759155-B2 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | STATS CHIPPAC, LTD. (SG) | 2014-06-24 | — | — | US | disclosed |
| US-20140011248-A1 | CONVERSION OF BIOMASS | XYLECO, INC. | 2014-01-09 | — | — | US | disclosed |
| US-20130292806-A1 | Methods For Manganese Nitride Integration | APPLIED MATERIALS, INC. | 2013-11-07 | — | — | US | disclosed |
| US-8556950-B2 | Sterilizable indwelling catheters | BOSTON SCIENTIFIC SCIMED, INC. (US) | 2013-10-15 | — | — | US | disclosed |
| US-20130175696-A1 | Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief | STATS CHIPPAC, LTD. (SG) | 2013-07-11 | — | — | US | disclosed |
| US-20130154076-A1 | Semiconductor Device and Method of Forming Leadframe Interposer Over Semiconductor Die and TSV Substrate for Vertical Electrical Interconnect | STATS CHIPPAC, LTD. (SG) | 2013-06-20 | — | — | US | disclosed |
| EP-2400281-B1 | Pyroelectric detector, pyroelectric detection device, and electronic instrument | SEIKO EPSON CORP (JP) | 2013-05-22 | — | — | EP | disclosed |