⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL28854155 | 0.97 | — | — | |
| SCHEMBL2342296 | 0.97 | — | — | |
| SCHEMBL2163916 | 0.67 | — | — | |
| SCHEMBL75716 | 0.67 | — | — | |
| SCHEMBL507708 | 0.67 | — | — | |
| SCHEMBL18496466 | 0.66 | CYP1A2 (0.57) | — | |
| SCHEMBL4407943 | 0.65 | — | — | |
| SCHEMBL96698 | 0.65 | — | — | |
| SCHEMBL19559685 | 0.65 | — | — | |
| SCHEMBL28681113 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 896 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12492340-B2 | Etchant | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-12-09 | — | — | US | claimed |
| US-12384967-B2 | Etchant | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-08-12 | — | — | US | claimed |
| CN-119223101-A | Environment-friendly airport bird repellent bomb | 中北大学 | 2024-12-31 | — | — | CN | claimed |
| CN-114381733-B | Etching solution composition and method for manufacturing array substrate for display device using same | 东友精细化工有限公司 | 2024-11-08 | — | — | CN | claimed |
| CN-118598854-A | Small molecular compound with high HPPD (high-pressure sensitive PD) inhibitory activity and synthesis method thereof | 上海冰鉴信息科技有限公司 | 2024-09-06 | — | — | CN | claimed |
| CN-118516673-A | MTD-Cu-MTD etching solution and etching method | 湖北兴福电子材料股份有限公司 | 2024-08-20 | — | — | CN | claimed |
| CN-117903802-A | Polysilicon etching solution and application | 湖北兴福电子材料股份有限公司 | 2024-04-19 | — | — | CN | claimed |
| CN-117904633-A | Copper-free aluminum etching solution | 江苏艾森半导体材料股份有限公司 | 2024-04-19 | — | — | CN | claimed |
| CN-117758104-A | Copper-molybdenum alloy wire for electronic device, manganese plating process and manganese plating solution thereof | 余姚市爱迪升电镀科技有限公司 | 2024-03-26 | — | — | CN | claimed |
| CN-117590708-A | Dry film removing liquid and preparation method and application thereof | 江苏艾森半导体材料股份有限公司 | 2024-02-23 | — | — | CN | claimed |
| US-20050097825-A1 | Compositions and methods for a barrier removal | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-05-12 | — | — | US | claimed |
| CN-1451031-A | Method for roughening copper surfaces for bonding to substrates | ELECTROCHEMICALS INC (US) | 2003-10-22 | — | — | CN | claimed |
| JP-2003519286-A | — | — | 2003-06-17 | — | — | JP | claimed |
| EP-1255797-A1 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | ELECTROCHEMICALS INC. (US) | 2002-11-13 | — | — | EP | claimed |
| WO-2001049805-A1 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | ELECTROCHEMICALS INC. (US) | 2001-07-12 | — | — | WO | claimed |
| CN-1209468-A | Micro-etching agent for copper and copper alloy | MIKEDO K K (JP) | 1999-03-03 | — | — | CN | claimed |
| EP-0890660-A1 | Microetching agent for copper or copper alloys | MEC CO., Ltd. (JP) | 1999-01-13 | — | — | EP | claimed |
| US-4629679-A | ENHANCED ADHESION TO METAL SURFACES; PRINTED CIRCUITS | MITSUBISHI RAYON COMPANY LTD. (JP) | 1986-12-16 | — | — | US | claimed |
| US-4248868-A | FOR TREATING SYSTEMIC INFECTIONS BY GRAMPOSITIVE AND GRAM NEGATIVE BACTERIA | CIBA-GEIGY CORPORATION (US) | 1981-02-03 | — | — | US | claimed |
| US-3948703-A | Method of chemically polishing copper and copper alloy | TOKAI DENKA KOGYO KABUSHIKI KAISHA (JA) | 1976-04-06 | — | — | US | claimed |