SCHEMBL149992

SCHEMBL149992

C=CC(=O)OC(C)C[Si](C)(OC)OC

nearest known ligand 0.41

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.41
HPGD P15428 1/20 0.32
ALDH1A1 P00352 3/20 0.31
TP53 P04637 2/20 0.31
HIF1A Q16665 2/20 0.31
CYP3A4 P08684 1/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2799768 0.84 TSHR (0.38) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL9303495 0.84 TSHR (0.44) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL11587664 0.83 TSHR (0.42) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1144331 0.83 TSHR (0.42) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL5605420 0.82 TSHR (0.39) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL21359809 0.82 TSHR (0.36) TSHRHPGDALDH1A1CYP3A4
SCHEMBL21359746 0.80 TSHR (0.35) TSHRHPGDALDH1A1CYP3A4
SCHEMBL10958858 0.79 TSHR (0.45) TSHRALDH1A1
SCHEMBL19712271 0.77 TSHR (0.38) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL2878245 0.76 TSHR (0.40) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116261491-B Coating agent for plexiglass and plexiglass 株式会社丰田自动织机 2024-07-02 CN claimed
CN-114207071-A Foldable adhesive film and method of making same 株式会社LG化学 2022-03-18 CN disclosed
CN-107001583-B Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2019-06-18 CN disclosed
CN-106795275-B Actinic-radiation curable composition 株式会社钟化 2019-03-05 CN disclosed
CN-109312038-A Active energy ray-curable resin composition, resin molded article, and method for producing resin molded article 三菱化学株式会社 2019-02-05 CN disclosed
CN-108026411-A Coating composition 关西涂料株式会社 2018-05-11 CN disclosed
CN-108026384-A The manufacture method of silica particle dispersion covered with acrylic resin 关西涂料株式会社 2018-05-11 CN disclosed
EP-2428540-B1 Coating composition SHINETSU CHEMICAL CO (JP) 2018-02-21 EP disclosed
CN-105246974-B Have the polymer and blend polymer of the glossiness of enhancing 科思创有限公司 2017-11-24 CN disclosed
CN-107001583-A Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2017-08-01 CN disclosed
US-20040236020-A1 Block copolymer KANEKA CORPORATION (JP) 2004-11-25 US disclosed
US-20040220364-A1 Process for producing polymer having crosslinkable silyl group and curable composition KANEKA CORPORATION (JP) 2004-11-04 US disclosed
US-20040171765-A1 Polyurethane polymer KANEKA CORPORATION (JP) 2004-09-02 US disclosed
EP-1452550-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-09-01 EP disclosed
EP-1447422-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-08-18 EP disclosed
US-20040106732-A1 Thermoplastic resin composition and elastomer composition KANEKA CORPORATION (JP) 2004-06-03 US disclosed
US-20040097678-A1 Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition KANEKA CORPORATION (JP) 2004-05-20 US disclosed
EP-1411070-A1 BLOCK COPOLYMER KANEKA CORPORATION (JP) 2004-04-21 EP disclosed
EP-1403291-A1 PROCESS FOR PRODUCING POLYMER HAVING CROSSLINKABLE SILYL GROUP AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-03-31 EP disclosed
EP-1375531-A1 PROCESS FOR PRODUCING VINYL POLYMER HAVING ALKENYL GROUP AT END, VINYL POLYMER, AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-01-02 EP disclosed