SCHEMBL149993

SCHEMBL149993

C=CC(=O)OC(C)CC[SiH](OC)OC

nearest known ligand 0.39

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
ALDH1A1 P00352 1/20 0.31
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HIF1A Q16665 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28382268 0.90 TSHR (0.37) TSHRALDH1A1CYP3A4HPGD
SCHEMBL28039757 0.89 TSHR (0.32) TSHR
SCHEMBL28006019 0.85 TSHR (0.38) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL4225957 0.84 TSHR (0.36) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL5605423 0.83 TSHR (0.37) TSHRHPGD
SCHEMBL28164116 0.83 TSHR (0.35) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL11629214 0.82 TSHR (0.41) TSHRALDH1A1TP53CYP3A4HIF1A
SCHEMBL27969849 0.82 TSHR (0.41) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL28211234 0.82 TSHR (0.36) TSHRHPGD
SCHEMBL672062 0.81 TSHR (0.50) TSHRALDH1A1TP53CYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 295 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110312766-A coating composition, coating film and electromagnetic interference shielding composite material 株式会社LG化学 2019-10-08 CN claimed
CN-109207060-A The non-aqueous sol-gel of Adhesion enhancement for water sensitive material 波音公司 2019-01-15 CN claimed
CN-107849253-A Polysiloxane and moisture and the adhesive composition of radiation-curable comprising it 汉高知识产权控股有限责任公司 2018-03-27 CN claimed
CN-105693141-B A kind of preparation method of dielectric composite material for fingerprint sensor inductive layer 天津德高化成新材料股份有限公司 2017-08-04 CN claimed
CN-106661136-A Process for emulsion polymerization of free-radically polymerizable, ethylenically unsaturated monomers 塞拉尼斯销售德国有限公司 2017-05-10 CN claimed
CN-103168057-B (meth) acrylate composition IDEMITSU KOSAN CO 2015-06-24 CN claimed
CN-102372887-B Heat-curable resin composition for protective film LG CHEMICAL LTD 2015-01-21 CN claimed
EP-3674335-B1 POLYMER BASED ON (METH)ACRYLIC ACID ALKYL ESTER AND USE THEREOF SOKEN KAGAKU KK (JP) 2024-01-03 EP disclosed
US-11634523-B2 (Meth)acrylic acid alkyl ester polymer and use thereof SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2023-04-25 US disclosed
CN-114207071-A Foldable adhesive film and method of making same 株式会社LG化学 2022-03-18 CN disclosed
US-20200362156-A1 (Meth)Acrylic Acid Alkyl Ester Polymer and Use Thereof SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2020-11-19 US disclosed
EP-3674335-A1 POLYMER BASED ON (METH)ACRYLIC ACID ALKYL ESTER AND USE THEREOF Soken Chemical & Engineering Co., Ltd. (JP) 2020-07-01 EP disclosed
CN-106663811-B Anode and its manufacturing method 株式会社LG 化学 2019-11-12 CN disclosed
CN-104245846-A Polysiloxane composition having radical-crosslinkable group ASAHI KASEI E MATERIALS CORP 2014-12-24 CN disclosed
CN-104245847-A CURABLE RESIN COMPOSITION AND CURABLE PRODUCT THEREOF DAICEL CORP 2014-12-24 CN disclosed
CN-104245766-A Photocurable resin composition YOKOHAMA RUBBER CO LTD 2014-12-24 CN disclosed
CN-104221481-A Electroconductive pattern, electric circuit, electromagnetic wave shield, and method for manufacturing the electroconductive pattern DAINIPPON INK & CHEMICALS 2014-12-17 CN disclosed
US-8642672-B2 Coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-02-04 US disclosed
EP-2428540-A1 Coating composition Shin-Etsu Chemical Co., Ltd. (JP) 2012-03-14 EP disclosed
US-20120059080-A1 COATING COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-03-08 US disclosed